SHIN; Kang Sup

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIN; Kang Sup.The latest application filed is for "semiconductor device having a high breakdown voltage capacitor and method for forming the same".

Company Profile

1.10.14

SHIN; Kang Sup - Cheongju-si KR
Shin; Kang Sup - Cheonju-si KR
Shin; Kang Sup - Cheongju-Shi KR
Shin; Kang Sup - Icheon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Having A High Breakdown Voltage Capacitor And Method For Forming The Same App 20220277900 - JEONG; Jong Yeul ; et al.	2022-09-01
Semiconductor Device Having Deep Trench Structure And Method Of Manufacturing Thereof App 20220270932 - KANG; Yang Beom ; et al.	2022-08-25
Semiconductor device having deep trench structure and method of manufacturing thereof Grant 11,367,661 - Kang , et al. June 21, 2	2022-06-21
Semiconductor device having deep trench structure and method of manufacturing thereof Grant 11,018,060 - Kang , et al. May 25, 2	2021-05-25
Semiconductor Device Having Deep Trench Structure And Method Of Manufacturing Thereof App 20210066134 - KANG; Yang Beom ; et al.	2021-03-04
Semiconductor Device Having Deep Trench Structure And Method Of Manufacturing Thereof App 20200343145 - KANG; Yang Beom ; et al.	2020-10-29
Semiconductor device having circuitry positioned above a buried magnetic sensor Grant 10,700,265 - Hebert , et al.	2020-06-30
Semiconductor device having a deep-trench capacitor including void and fabricating method thereof Grant 10,529,797 - Kang , et al. J	2020-01-07
Semiconductor Device Having A Deep-trench Capacitor Including Void And Fabricating Method Thereof App 20190181217 - KANG; Yang Beom ; et al.	2019-06-13
Magnetic sensor and method of fabricating the same Grant 10,256,396 - Kim , et al.	2019-04-09
Semiconductor Device Having Circuitry Positioned Above A Buried Magnetic Sensor App 20180240965 - HEBERT; Francois ; et al.	2018-08-23
Semiconductor device having circuitry positioned above a buried magnetic sensor Grant 10,003,013 - Hebert , et al. June 19, 2	2018-06-19
Metal wiring of semiconductor device and method for manufacturing the same Grant 9,558,992 - Kim , et al. January 31, 2	2017-01-31
Magnetic Sensor And Method Of Fabricating The Same App 20160322561 - KIM; Kwan Soo ; et al.	2016-11-03
Magnetic sensor and method of fabricating the same Grant 9,419,206 - Kim , et al. August 16, 2	2016-08-16
Metal Wiring Of Semiconductor Device And Method For Manufacturing The Same App 20160225661 - KIM; Kwan Soo ; et al.	2016-08-04
Metal wiring of semiconductor device and method for manufacturing the same Grant 9,362,207 - Kim , et al. June 7, 2	2016-06-07
Semiconductor Device Having A Buried Magnetic Sensor App 20150255709 - HEBERT; Francois ; et al.	2015-09-10
Magnetic Sensor And Method Of Fabricating The Same App 20140252514 - KIM; Kwan Soo ; et al.	2014-09-11
Metal Wiring Of Semiconductor Device And Method For Manufacturing The Same App 20140035146 - Kim; Kwan-soo ; et al.	2014-02-06
Method for forming interlayer insulation film in semiconductor device Grant 7,160,810 - Shin , et al. January 9, 2	2007-01-09
Composition for cleaning semiconductor device and method for cleaning semiconductor device using the same App 20060234516 - Hong; Eun Suk ; et al.	2006-10-19
Method for forming interlayer insulation film in semiconductor device App 20050142848 - Shin, Kang Sup ; et al.	2005-06-30

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