Shin; Junghoon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shin; Junghoon.The latest application filed is for "electronic apparatus and method for manufacturing the same".
- Shin; Junghoon - Gimpo-si KR
- SHIN; Junghoon - Seongnam-si KR
- SHIN; Junghoon - Suwon-si KR
- Shin; Junghoon - Seoul KR
- Shin; JungHoon - Choongbook N/A KR
- Shin; Junghoon - Cheongjoo-si KR
| Patent | Date |
|---|---|
| Display apparatus Grant 11,211,444 - Shin December 28, 2 | 2021-12-28 |
| Electronic Apparatus And Method For Manufacturing The Same App 20210303091 - SON; Younghye ; et al. | 2021-09-30 |
| Electronic Apparatus And Control Method Thereof App 20200252499 - Kind Code | 2020-08-06 |
| Display Apparatus App 20200168694 - SHIN; Junghoon | 2020-05-28 |
| Backlight Assembly, Display Device Including The Same, And Methods Of Fabricating The Backlight Assembly And The Display Device App 20190162892 - SHIN; JUNGHOON | 2019-05-30 |
| Display device Grant 10,197,719 - Kang , et al. Fe | 2019-02-05 |
| Backlight unit Grant 10,088,625 - Shin , et al. October 2, 2 | 2018-10-02 |
| Display device Grant 9,927,569 - Kim , et al. March 27, 2 | 2018-03-27 |
| Apparatus and method for collecting harmful website information Grant 9,749,352 - Lee , et al. August 29, 2 | 2017-08-29 |
| Display Device App 20170184775 - KANG; Euijeong ; et al. | 2017-06-29 |
| Display Device App 20160170125 - KIM; Youngchun ; et al. | 2016-06-16 |
| Backlight Unit App 20160139320 - SHIN; JUNGHOON ; et al. | 2016-05-19 |
| Apparatus And Method For Collecting Harmful Website Information App 20150341381 - LEE; Sangjun ; et al. | 2015-11-26 |
| System and method for directional grinding on backside of a semiconductor wafer Grant 8,994,196 - Lee , et al. March 31, 2 | 2015-03-31 |
| Display Device Including Backlight Assembly App 20140204609 - SHIN; Junghoon ; et al. | 2014-07-24 |
| Ultra thin bumped wafer with under-film Grant 8,704,366 - Shin , et al. April 22, 2 | 2014-04-22 |
| Ultra thin bumped wafer with under-film Grant 8,329,554 - Shin , et al. December 11, 2 | 2012-12-11 |
| Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 8,232,141 - Choi , et al. July 31, 2 | 2012-07-31 |
| Grooving bumped wafer pre-underfill system Grant 8,030,769 - Shin , et al. October 4, 2 | 2011-10-04 |
| Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20110180935 - Choi; DaeSik ; et al. | 2011-07-28 |
| System and Method for Directional Grinding on Backside of a Semiconductor Wafer App 20110101546 - Lee; SungYoon ; et al. | 2011-05-05 |
| Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 7,923,304 - Choi , et al. April 12, 2 | 2011-04-12 |
| Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20110057308 - Choi; DaeSik ; et al. | 2011-03-10 |
| Ultra Thin Bumped Wafer With Under-Film App 20110045637 - Shin; Junghoon ; et al. | 2011-02-24 |
| Method for directional grinding on backside of a semiconductor wafer Grant 7,892,072 - Lee , et al. February 22, 2 | 2011-02-22 |
| Ultra Thin Bumped Wafer With Under-Film App 20110037172 - Shin; Junghoon ; et al. | 2011-02-17 |
| Ultra thin bumped wafer with under-film Grant 7,838,391 - Shin , et al. November 23, 2 | 2010-11-23 |
| Grooving Bumped Wafer Pre-Underfill System App 20100200986 - Shin; Junghoon ; et al. | 2010-08-12 |
| Grooving bumped wafer pre-underfill system Grant 7,727,875 - Shin , et al. June 1, 2 | 2010-06-01 |
| System and Method for Directional Grinding on Backside of a Semiconductor Wafer App 20090068933 - Lee; SungYoon ; et al. | 2009-03-12 |
| Grooving Bumped Wafer Pre-Underfill System App 20080318396 - SHIN; Junghoon ; et al. | 2008-12-25 |
| Ultra Thin Bumped Wafer with Under-Film App 20080280422 - Shin; Junghoon ; et al. | 2008-11-13 |
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