SHIN; Ji Hwan

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIN; Ji Hwan.The latest application filed is for "coil component".

Company Profile

0.8.20

SHIN; Ji Hwan - Suwon-si KR
Shin; Ji Hwan - Gyeonggi-do KR
SHIN; Ji Hwan - Suwon KR
SHIN; Ji Hwan - Yongin KR
Shin; Ji Hwan - Yongin-si KR
Shin; Ji Hwan - Gyunggi-do KR
Shin; Ji Hwan - Kyungki-do KR
Shin, Ji Hwan - Songnam KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coil Component App 20220199313 - PARK; Il Jin ; et al.	2022-06-23
Coil Electronic Component App 20220189676 - PARK; Joong Won ; et al.	2022-06-16
Low temperature co-fired ceramic substrate with embeded capacitors Grant 9,681,551 - Na , et al. June 13, 2	2017-06-13
Substrate and method for manufacturing the same, and probe card Grant 9,188,607 - Hwang , et al. November 17, 2	2015-11-17
Low Temperature Co-fired Ceramic Substrate With Embeded Capacitors App 20150122536 - NA; Ji-Sung ; et al.	2015-05-07
Board For Probe Card, Method Of Manufacturing The Same, And Probe Card App 20150028912 - CHO; Beom Joon ; et al.	2015-01-29
Method Of Manufacturing Fine Metal Powder And Fine Metal Powder Manufactured By Using The Same App 20140193656 - WI; Sung Kwon ; et al.	2014-07-10
Substrate And Method For Manufacturing The Same, And Probe Card App 20130141079 - HWANG; Gyu Man ; et al.	2013-06-06
Nanocomposite Powder For Inner Electrode Of Multilayer Ceramic Electronic Device And Fabricating Method Thereof App 20120169447 - YANG; Ju Hwan ; et al.	2012-07-05
Method Of Manufacturing Fine Metal Powder And Fine Metal Powder Manufactured By Using The Same App 20120135262 - WI; Sung Kwon ; et al.	2012-05-31
Apparatus And Method For Manufacturing Board For Production Of Metal Flake App 20120126460 - SHIN; Ji Hwan ; et al.	2012-05-24
Method Of Manufacturing Ultra Fine Metal Powder And Ultra Fine Metal Powder Manufactured By The Same App 20120100036 - SHIN; Ji Hwan ; et al.	2012-04-26
Preparing Method Of Metal Powder And Method Of Manufacturing Inner Electrode Of Multilayer Ceramic Capacitor Using The Same App 20110294073 - SHIN; Ji Hwan ; et al.	2011-12-01
Member for adjusting horizontality, and probe card with the same App 20110181314 - Hwang; Gyu Man ; et al.	2011-07-28
Probe Card App 20110156740 - Hwang; Gyu Man ; et al.	2011-06-30
Method of manufacturing multi-layer ceramic condenser Grant 7,926,154 - Hong , et al. April 19, 2	2011-04-19
Shutter device Grant 7,857,529 - Lim , et al. December 28, 2	2010-12-28
Shutter Device App 20090263119 - Lim; Soo Cheol ; et al.	2009-10-22
Method Of Manufacturing Multi-layer Ceramic Condenser App 20090126174 - Hong; Ki Pyo ; et al.	2009-05-21
Semiconductive chip device having insulating coating layer and method of manfacturing the same App 20060180899 - Ko; Kyung Hee ; et al.	2006-08-17
Dual band coupler Grant 6,756,860 - Shin June 29, 2	2004-06-29
Multi-layer chip directional coupler Grant 6,642,809 - Shin , et al. November 4, 2	2003-11-04
Method and device for sealing ceramic package of saw filter Grant 6,627,966 - Jeong , et al. September 30, 2	2003-09-30
Dual band coupler App 20030117230 - Shin, Ji Hwan	2003-06-26
Multi-layer chip directional coupler App 20020110326 - Shin, Ji-Hwan ; et al.	2002-08-15
Method and device for sealing ceramic package of saw filter App 20020062904 - Jeong, Seung Gyo ; et al.	2002-05-30

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