loadpatents
Patent applications and USPTO patent grants for Shin; Jae Bong.The latest application filed is for "bonding stage and bonding apparatus comprising the same".
Patent | Date |
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Bonding stage and bonding apparatus comprising the same Grant 10,058,952 - Seok , et al. August 28, 2 | 2018-08-28 |
Bonding Stage and Bonding Apparatus Comprising the Same App 20170136570 - Seok; Seung Dae ;   et al. | 2017-05-18 |
Semiconductor manufacturing apparatuses comprising bonding heads Grant 9,508,577 - Lee , et al. November 29, 2 | 2016-11-29 |
Apparatus for bonding semiconductor chips Grant 9,431,365 - Seok , et al. August 30, 2 | 2016-08-30 |
Apparatus For Bonding Semiconductor Chips App 20160079199 - SEOK; Seung-dae ;   et al. | 2016-03-17 |
Semiconductor Manufacturing Apparatuses And Methods Thereof App 20150155210 - LEE; Byung Joon ;   et al. | 2015-06-04 |
Chip Bonding Apparatus App 20130248114 - SEOK; Seung Dae ;   et al. | 2013-09-26 |
Chip Bonding Apparatus And Chip Bonding Method Using The Same App 20130139380 - LEE; Byung Joon ;   et al. | 2013-06-06 |
Flip Chip Bonding Apparatus And Manufacturing Method Thereof App 20120118876 - Cho; Jung Hyun ;   et al. | 2012-05-17 |
Wafer bonding apparatus App 20100071847 - Shin; Jae Bong ;   et al. | 2010-03-25 |
Die attaching apparatus Grant 7,650,687 - Woo , et al. January 26, 2 | 2010-01-26 |
Apparatus for painting traffic marks on road surface Grant 7,294,204 - Hong , et al. November 13, 2 | 2007-11-13 |
Die attaching apparatus, and system and method for cleaning the same App 20060048381 - Woo; Jung-Hwan ;   et al. | 2006-03-09 |
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