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Patent applications and USPTO patent grants for SHIN; Hye Suk.The latest application filed is for "copper clad laminate and method for manufacturing the same".
Patent | Date |
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Copper Clad Laminate And Method For Manufacturing The Same App 20150230335 - LEE; Kwang Jik ;   et al. | 2015-08-13 |
Heat Radiating Substrate And Manufacturing Method Thereof App 20140174794 - KANG; Joon Seok ;   et al. | 2014-06-26 |
Printed Circuit Board And Method For Manufacturing The Same App 20140054072 - LEE; Kwang Jik ;   et al. | 2014-02-27 |
Metal Heat Radiation Substrate And Manufacturing Method Thereof App 20140041906 - KANG; Joon Seok ;   et al. | 2014-02-13 |
Electrode Pattern And Method Of Manufacturing The Same, Printed Circuit Board Using Electrode Pattern And Method Of Manufacturing The Same App 20140034358 - Lee; Kwang Jik ;   et al. | 2014-02-06 |
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