loadpatents
name:-0.0058021545410156
name:-0.00044918060302734
name:-0.00038886070251465
SHIN; Hye Suk Patent Filings

SHIN; Hye Suk

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIN; Hye Suk.The latest application filed is for "copper clad laminate and method for manufacturing the same".

Company Profile
0.0.5
  • SHIN; Hye Suk - Hwasung-si KR
  • Shin; Hye Suk - Hwasung KR
  • Shin; Hye Suk - Suwon KR
  • SHIN; Hye Suk - Suwon-si KR
  • Shin; Hye Suk - Gyeonggi-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper Clad Laminate And Method For Manufacturing The Same
App 20150230335 - LEE; Kwang Jik ;   et al.
2015-08-13
Heat Radiating Substrate And Manufacturing Method Thereof
App 20140174794 - KANG; Joon Seok ;   et al.
2014-06-26
Printed Circuit Board And Method For Manufacturing The Same
App 20140054072 - LEE; Kwang Jik ;   et al.
2014-02-27
Metal Heat Radiation Substrate And Manufacturing Method Thereof
App 20140041906 - KANG; Joon Seok ;   et al.
2014-02-13
Electrode Pattern And Method Of Manufacturing The Same, Printed Circuit Board Using Electrode Pattern And Method Of Manufacturing The Same
App 20140034358 - Lee; Kwang Jik ;   et al.
2014-02-06

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