Shin; Hye Sook

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shin; Hye Sook.The latest application filed is for "insulation resin composition for printed circuit board having improved thermal conductivity and electrical properties, insulating film, prepreg and printed circuit board".

Company Profile

0.3.11

Shin; Hye Sook - Suwon-Si KR
Shin; Hye Sook - Suwon KR
Shin; Hye Sook - Gyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Insulation Resin Composition For Printed Circuit Board Having Improved Thermal Conductivity And Electrical Properties, Insulating Film, Prepreg And Printed Circuit Board App 20140353004 - Jung; Hyun Chul ; et al.	2014-12-04
Prepreg, Method For Manufacturing The Same, And Copper Clad Laminate Using The Same App 20140187112 - Shin; Sang Hyun ; et al.	2014-07-03
Resin Composition With Enhanced Heat-releasing Properties, Heat-releasing Film, Insulating Film, And Prepreg App 20140187674 - Lee; Kwang Jik ; et al.	2014-07-03
Insulating Film For Printed Circuit Board Having Improved Thermal Conductivity, Manufacturing Method Thereof, And Printed Circuit Board Using The Same App 20140174792 - Son; Jang Bae ; et al.	2014-06-26
Package Substrate And Method Of Manufacturing The Same App 20130319734 - Shin; Sang Hyun ; et al.	2013-12-05
Heat-radiating substrate and manufacturing method thereof Grant 8,338,714 - Kang , et al. December 25, 2	2012-12-25
Heat Dissipating Circuit Board And Method Of Manufacturing The Same App 20120273558 - SHIN; Hye Sook ; et al.	2012-11-01
Heat dissipating circuit board and method of manufacturing the same Grant 8,242,371 - Shin , et al. August 14, 2	2012-08-14
Rigid-flexible circuit board and method of manufacturing the same Grant 8,198,543 - Kang , et al. June 12, 2	2012-06-12
Heat-radiating Substrate And Manufacturing Method Thereof App 20110240346 - Kang; Jung Eun ; et al.	2011-10-06
Heat Dissipating Substrate App 20110088928 - LIM; Chang Hyun ; et al.	2011-04-21
Rigid-flexible Circuit Board And Method Of Manufacturing The Same App 20110075374 - KANG; Jung Eun ; et al.	2011-03-31
Heat Dissipating Circuit Board And Method Of Manufacturing The Same App 20110067902 - SHIN; Hye Sook ; et al.	2011-03-24

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