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Patent applications and USPTO patent grants for Shin; Hye-In.The latest application filed is for "block copolymer of polymide and polyamic acid, method for producing the block copolymer, photosensitive resin composition comprising the block copolymer and protective film formed using the block copolymer".
Patent | Date |
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Positive photosensitive polyimide composition Grant 8,758,976 - Seong , et al. June 24, 2 | 2014-06-24 |
Block Copolymer Of Polymide And Polyamic Acid, Method For Producing The Block Copolymer, Photosensitive Resin Composition Comprising The Block Copolymer And Protective Film Formed Using The Block Copolymer App 20130189622 - KIM; Sang-Woo ;   et al. | 2013-07-25 |
Photosensitive Resin Composition Containing Polyimide Resin And Novolak Resin App 20110123927 - Park; Chan Hyo ;   et al. | 2011-05-26 |
Positive Photosensitive Polyimide Composition App 20110059397 - Seong; Hye-Ran ;   et al. | 2011-03-10 |
Block copolymer of polyimide and polyamic acid, method for producing the block copolymer, photosensitive resin composition comprising the block copolymer and protective film formed using the block copolymer App 20100069520 - Kim; Sang-Woo ;   et al. | 2010-03-18 |
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