loadpatents
Patent applications and USPTO patent grants for Shin; Heung Hyun.The latest application filed is for "interferometer for tsv measurement and measurement method using same".
Patent | Date |
---|---|
Interferometer for TSV measurement and measurement method using same Grant 8,873,067 - Lee , et al. October 28, 2 | 2014-10-28 |
Interferometer for TSV Measurement and Measurement Method Using Same App 20140036273 - Lee; Ki Hun ;   et al. | 2014-02-06 |
Plasma monitoring device and method Grant 8,416,293 - Shin , et al. April 9, 2 | 2013-04-09 |
Plasma Monitoring Device And Method App 20100149326 - Shin; Heung Hyun ;   et al. | 2010-06-17 |
Detecting Materials On Wafer And Repair System And Method Thereof App 20100029019 - PARK; Heui Jae ;   et al. | 2010-02-04 |
Device For Processing Materials By Laser Beam App 20100006549 - Pahk; Heui Jae ;   et al. | 2010-01-14 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.