Shin; Hee Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shin; Hee Min.The latest application filed is for "semiconductor packages including flexible wing interconnection substrate".

Company Profile

0.11.11

Shin; Hee Min - Seongnam-si KR
SHIN; Hee Min - Seongnam-si Gyeonggi-do KR
Shin; Hee Min - Cheongju-si KR
SHIN; Hee Min - Cheongju-si Chungcheongbuk-do KR
SHIN; Hee Min - Chungcheongbuk-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages having EMI shielding parts and methods of fabricating the same Grant 9,842,809 - Moon , et al. December 12, 2	2017-12-12
Semiconductor packages including flexible wing interconnection substrate Grant 9,659,909 - Shin , et al. May 23, 2	2017-05-23
Semiconductor Packages Including Flexible Wing Interconnection Substrate App 20170084579 - SHIN; Hee Min ; et al.	2017-03-23
Semiconductor Packages Having Emi Shielding Parts And Methods Of Fabricating The Same App 20170047293 - MOON; Ki Ill ; et al.	2017-02-16
Stack package and method for manufacturing the same Grant 9,305,912 - Shin , et al. April 5, 2	2016-04-05
Stack Package And Method For Manufacturing The Same App 20150270252 - SHIN; Hee Min ; et al.	2015-09-24
Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same Grant 9,093,441 - Kim , et al. July 28, 2	2015-07-28
Stack package and method for manufacturing the same Grant 9,082,634 - Shin , et al. July 14, 2	2015-07-14
Methods for forming interconnection line using screen printing technique Grant 8,951,810 - Lee , et al. February 10, 2	2015-02-10
Semiconductor Packages Including Semiconductor Chips Having Protrusions And Methods Of Fabricating The Same App 20140175638 - KIM; Ji Eun ; et al.	2014-06-26
Methods For Forming Interconnection Line Using Screen Printing Technique App 20140057369 - LEE; Kyu Won ; et al.	2014-02-27
Chip unit and stack package having the same Grant 8,564,141 - Lee , et al. October 22, 2	2013-10-22
Stacked Semiconductor Package And Method For Manufacturing The Same App 20130256887 - LEE; Kyu Won ; et al.	2013-10-03
Stacked semiconductor package and method for manufacturing the same Grant 8,476,751 - Lee , et al. July 2, 2	2013-07-02
Stack Package And Method For Manufacturing The Same App 20120018879 - SHIN; Hee-Min ; et al.	2012-01-26
Chip Unit And Stack Package Having The Same App 20110272798 - LEE; Kyu Won ; et al.	2011-11-10
Stacked Semiconductor Package And Method For Manufacturing The Same App 20110272820 - LEE; Kyu Won ; et al.	2011-11-10
Wafer Mount Tape, Wafer Processing Apparatus And Method Of Using The Same For Use In Thinning Wafers App 20110189928 - SHIN; Hee Min ; et al.	2011-08-04
Wafer Mount Tape, Wafer Processing Apparatus And Method Of Using The Same For Use In Thinning Wafers App 20100092718 - SHIN; Hee Min ; et al.	2010-04-15

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