SHIN; Dong Hwi
Patent Applications and Registrations
Patent applications and USPTO patent grants for SHIN; Dong Hwi.The latest application filed is for "ceramic electronic component".
- SHIN; Dong Hwi - Suwon-si KR
- Shin; Dong Hwi - Seongnam-Shi KR
- Shin; Dong Hwi - Gyeonggi-Do KR
| Patent | Date |
|---|---|
| Ceramic Electronic Component App 20220246357 - KIM; Dong Yeong ; et al. | 2022-08-04 |
| Multilayer ceramic electronic component Grant 11,393,627 - Yun , et al. July 19, 2 | 2022-07-19 |
| Multi-layer Ceramic Electronic Component App 20220216009 - JUNG; In Kyung ; et al. | 2022-07-07 |
| Multilayer Capacitor And Board Having The Same Mounted Thereon App 20220208451 - Cho; A Ra ; et al. | 2022-06-30 |
| Multilayer Electronic Component App 20220165497 - JEONG; Eun Hee ; et al. | 2022-05-26 |
| Multilayer Ceramic Electronic Component App 20220157529 - JUNG; In Kyung ; et al. | 2022-05-19 |
| Ceramic electronic component Grant 11,335,506 - Kim , et al. May 17, 2 | 2022-05-17 |
| Multi-layer ceramic electronic component Grant 11,315,732 - Jung , et al. April 26, 2 | 2022-04-26 |
| Multilayer ceramic electronic component having effective coverage of external electrode Grant 11,282,646 - Jung , et al. March 22, 2 | 2022-03-22 |
| Ceramic Electronic Component App 20210358692 - SHIN; Dong Hwi ; et al. | 2021-11-18 |
| Multilayer capacitor Grant 11,139,114 - Ahn , et al. October 5, 2 | 2021-10-05 |
| Ceramic electronic component having external electrode including electrode layer and conductive resin layer Grant 11,107,633 - Shin , et al. August 31, 2 | 2021-08-31 |
| Ceramic electronic component Grant 11,101,074 - Shin , et al. August 24, 2 | 2021-08-24 |
| Multilayer ceramic electronic component Grant 11,081,281 - Lee , et al. August 3, 2 | 2021-08-03 |
| Multilayer Ceramic Electronic Component And Manufacturing Method Thereof App 20210193387 - YUN; Hyung Duk ; et al. | 2021-06-24 |
| Multilayer Ceramic Electronic Component App 20210175016 - YUN; Hyung Duk ; et al. | 2021-06-10 |
| Multilayer Ceramic Electronic Component App 20210065982 - JUNG; In Kyung ; et al. | 2021-03-04 |
| Multi-layer Ceramic Electronic Component App 20210065980 - JUNG; In Kyung ; et al. | 2021-03-04 |
| Multilayer ceramic electronic component Grant 10,879,006 - Kim , et al. December 29, 2 | 2020-12-29 |
| Multilayer electronic component Grant 10,832,869 - Kim , et al. November 10, 2 | 2020-11-10 |
| Ceramic Electronic Component App 20200135401 - Shin; Dong Hwi ; et al. | 2020-04-30 |
| Ceramic Electronic Component App 20200111615 - KIM; Dong Yeong ; et al. | 2020-04-09 |
| Multilayer Ceramic Electronic Component App 20200105475 - LEE; Sang Roc ; et al. | 2020-04-02 |
| Ceramic Electronic Component App 20200098523 - Shin; Dong Hwi ; et al. | 2020-03-26 |
| Multilayer Capacitor App 20200090871 - AHN; Jin Mo ; et al. | 2020-03-19 |
| Multilayer Electronic Component App 20200075257 - Kim; Je Jung ; et al. | 2020-03-05 |
| Multilayer Ceramic Electronic Component App 20200075252 - KIM; Je Jung ; et al. | 2020-03-05 |
| Multilayer ceramic electronic component Grant 10,395,839 - Park , et al. A | 2019-08-27 |
| Multilayer ceramic electronic component Grant 10,395,840 - Park , et al. A | 2019-08-27 |
| Ceramic electronic component Grant 10,354,802 - Bae , et al. July 16, 2 | 2019-07-16 |
| Method of mechanized construction for earth wire under-bracing and extendable excavating unit for auger crane Grant 7,815,399 - Kwon , et al. October 19, 2 | 2010-10-19 |
| Method of Mechanized Construction for Earth Wire Under-Bracing and Extendable Excavating Unit for Auger Crane App 20090260891 - Kwon; Sae Won ; et al. | 2009-10-22 |
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