loadpatents
name:-0.016104221343994
name:-0.013165950775146
name:-0.00061702728271484
Shimoyama; Koji Patent Filings

Shimoyama; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shimoyama; Koji.The latest application filed is for "magnet roll".

Company Profile
0.14.12
  • Shimoyama; Koji - Mie N/A JP
  • Shimoyama; Koji - Hyogo N/A JP
  • Shimoyama; Koji - Itami JP
  • Shimoyama, Koji - Itami-shi JP
  • Shimoyama; Koji - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Combination of base layer and ink for inkjet for manufacturing electronic component
Grant 8,507,076 - Nakao , et al. August 13, 2
2013-08-13
Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
Grant 8,465,666 - Asahi , et al. June 18, 2
2013-06-18
Magnet Roll
App 20130149012 - Nakao; Keiichi ;   et al.
2013-06-13
Chip part manufacturing method and chip parts
Grant 8,426,249 - Ohba , et al. April 23, 2
2013-04-23
Inductance component
Grant 8,248,200 - Ishimoto , et al. August 21, 2
2012-08-21
Method of manufacturing base layer, ink for inkjet and electronic components
Grant 8,247,474 - Nakao , et al. August 21, 2
2012-08-21
Base layer for manufacturing an electronic component by an etching process
Grant 8,178,188 - Nakao , et al. May 15, 2
2012-05-15
Thermoconductive Composition, Heat Dissipating Plate, Heat Dissipating Substrate And Circuit Module Using Thermoconductive Composition, And Process For Production Of Thermoconductive Composition
App 20120025132 - Asahi; Toshiyuki ;   et al.
2012-02-02
Combination Of Base Layer And Ink For Inkjet For Manufacturing Electronic Component
App 20110293901 - NAKAO; Keiichi ;   et al.
2011-12-01
Method Of Manufacturing Base Layer, Ink For Inkjet And Electronic Components
App 20110205286 - NAKAO; Keiichi ;   et al.
2011-08-25
Method Of Manufacturing Base Layer, Ink For Inkjet And Electronic Components
App 20110203482 - NAKAO; Keiichi ;   et al.
2011-08-25
Chip Part Manufacturing Method And Chip Parts
App 20100255638 - Ohba; Mitio ;   et al.
2010-10-07
Inductance Component
App 20100182116 - Ishimoto; Hitoshi ;   et al.
2010-07-22
Method Of Manufacturing Base Layer, Ink For Inkjet And Electronic Components
App 20090104384 - NAKAO; Keiichi ;   et al.
2009-04-23
Electronic Component And Method For Manufacturing Same
App 20090078457 - Atsumi; Toshiyuki ;   et al.
2009-03-26
Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same
Grant 7,394,341 - Shimoyama , et al. July 1, 2
2008-07-01
Chip part manufacturing method and chip parts
App 20060091534 - Ohba; Mitio ;   et al.
2006-05-04
Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same
App 20050140488 - Shimoyama, Koji ;   et al.
2005-06-30
Solid electrolytic capacitor and method of manufacturing the same
Grant 6,909,596 - Shimoyama , et al. June 21, 2
2005-06-21
Solid electrolytic capacitor and method of manufacturing the same
App 20040264111 - Shimoyama, Koji ;   et al.
2004-12-30
Electronic device
Grant 6,791,818 - Shimoyama , et al. September 14, 2
2004-09-14
Method of producing a chip resistor
Grant 6,314,637 - Kimura , et al. November 13, 2
2001-11-13
Chip resistor
Grant 5,907,274 - Kimura , et al. May 25, 1
1999-05-25

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