Shimoura; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shimoura; Seiichi.The latest application filed is for "circuit board, method of forming wiring pattern, and method of manufacturing circuit board".

Company Profile

0.6.11

Shimoura; Seiichi - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of heating superposed components and heating apparatus therefor Grant 8,153,941 - Fujii , et al. April 10, 2	2012-04-10
Circuit board, method of forming wiring pattern, and method of manufacturing circuit board App 20090044972 - Kitajima; Masayuki ; et al.	2009-02-19
Electronic Device And Manufacturing Method Of Electronic Device App 20080298218 - TANAKA; Hisao ; et al.	2008-12-04
Processing Apparatus App 20080296266 - Okada; Toru ; et al.	2008-12-04
Method of producing a micro-actuator Grant 7,356,894 - Fujii , et al. April 15, 2	2008-04-15
Display Grant 6,903,876 - Okada , et al. June 7, 2	2005-06-07
Micro-actuator and method of producing the same App 20050104477 - Fujii, Masanao ; et al.	2005-05-19
Method of producing a micro-actuator Grant 6,848,154 - Fujii , et al. February 1, 2	2005-02-01
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method Grant 6,744,183 - Kitajima , et al. June 1, 2	2004-06-01
Micro-actuator and method of producing the same Grant 6,653,761 - Fujii , et al. November 25, 2	2003-11-25
Micro-actuator and method of producing the same App 20030184191 - Fujii, Masanao ; et al.	2003-10-02
Method of heating superposed components and heating apparatus therefor App 20030173411 - Fujii, Masanao ; et al.	2003-09-18
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20030137223 - Kitajima, Masayuki ; et al.	2003-07-24
Display App 20030103169 - Okada, Toru ; et al.	2003-06-05
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20020074902 - Kitajima, Masayuki ; et al.	2002-06-20
Method of assembling micro-actuator App 20020059717 - Okada, Toru ; et al.	2002-05-23
Micro-actuator and method of producing the same App 20020050767 - Fujii, Masanao ; et al.	2002-05-02

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