Shimokawa; Hiroto
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shimokawa; Hiroto.The latest application filed is for "method for producing flexible metal laminate".
- Shimokawa; Hiroto - Ube N/A JP
- Shimokawa; Hiroto - Ube-shi JP
- Shimokawa; Hiroto - Yamaguchi JP
| Patent | Date |
|---|---|
| Polyimide-metal laminate and solar cell Grant 9,373,735 - Shimokawa , et al. June 21, 2 | 2016-06-21 |
| Aromatic polyimide film, laminate and solar cell Grant 9,209,333 - Shimokawa , et al. December 8, 2 | 2015-12-08 |
| Method for producing flexible metal laminate Grant 8,858,751 - Kochiyama , et al. October 14, 2 | 2014-10-14 |
| Metal foil laminated polyimide resin substrate Grant 8,624,125 - Shimokawa , et al. January 7, 2 | 2014-01-07 |
| Method For Producing Flexible Metal Laminate App 20120168053 - Kochiyama; Takuro ; et al. | 2012-07-05 |
| Polyimide-metal Laminate And Solar Cell App 20110079277 - Shimokawa; Hiroto ; et al. | 2011-04-07 |
| Aromatic Polyimide Film, Laminate And Solar Cell App 20110067760 - Shimokawa; Hiroto ; et al. | 2011-03-24 |
| Metal Foil Laminated Polyimide Resin Substrate App 20110005812 - Shimokawa; Hiroto ; et al. | 2011-01-13 |
| Process For Producing Metal Wiring Board App 20090266589 - Shimokawa; Hiroto ; et al. | 2009-10-29 |
| Process For Producing Polyimide Film With Copper Wiring App 20090211786 - Bamba; Keita ; et al. | 2009-08-27 |
| Process For Producing Copper Wiring Polyimide Film, And Copper Wiring Polyimide Film App 20090136725 - Shimokawa; Hiroto ; et al. | 2009-05-28 |
| Polyimide-copper composite laminate App 20060154037 - Shimokawa; Hiroto ; et al. | 2006-07-13 |
| Copper-clad laminate App 20050019598 - Katsuki, Shozo ; et al. | 2005-01-27 |
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