Shimokawa; Hanae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shimokawa; Hanae.The latest application filed is for "semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method".
- Shimokawa; Hanae - Tokyo JP
- Shimokawa; Hanae - Yokohama JP
- Shimokawa; Hanae - Kamakura JP
| Patent | Date |
|---|---|
| Mechanical quantity measuring device and sensor unit Grant 10,481,023 - Shimokawa , et al. Nov | 2019-11-19 |
| Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method Grant 10,247,630 - Shimokawa , et al. | 2019-04-02 |
| Semiconductor Device, Mechanical Quantity Measuring Device, And Semiconductor Device Fabricating Method App 20180202883 - SHIMOKAWA; Hanae ; et al. | 2018-07-19 |
| Mechanical Quantity Measuring Device and Sensor Unit App 20170108390 - SHIMOKAWA; Hanae ; et al. | 2017-04-20 |
| Pb-free solder-connected structure Grant 8,907,475 - Shimokawa , et al. December 9, 2 | 2014-12-09 |
| Pb-FREE SOLDER-CONNECTED STRUCTURE App 20130286621 - SHIMOKAWA; Hanae ; et al. | 2013-10-31 |
| Pb-free solder-connected structure and electronic device Grant 8,503,189 - Shimokawa , et al. August 6, 2 | 2013-08-06 |
| Semiconductor power module Grant 8,125,090 - Soga , et al. February 28, 2 | 2012-02-28 |
| Solder composition for electronic devices Grant 8,022,551 - Soga , et al. September 20, 2 | 2011-09-20 |
| Semiconductor power module including epoxy resin coating Grant 8,004,075 - Soga , et al. August 23, 2 | 2011-08-23 |
| Semiconductor Power Module App 20100289148 - SOGA; Tasao ; et al. | 2010-11-18 |
| Pb-free solder-connected structure and electronic device App 20100214753 - SHIMOKAWA; Hanae ; et al. | 2010-08-26 |
| Pb-free solder-connected structure and electronic device Grant 7,709,746 - Shimokawa , et al. May 4, 2 | 2010-05-04 |
| Semiconductor Power Module App 20070246833 - Soga; Tasao ; et al. | 2007-10-25 |
| Semiconductor device with lead-free solder Grant 7,259,465 - Soga , et al. August 21, 2 | 2007-08-21 |
| Solder composition for electronic devices App 20070031279 - Soga; Tasao ; et al. | 2007-02-08 |
| Semiconductor device having solder bumps reliably reflow solderable Grant 7,145,236 - Miura , et al. December 5, 2 | 2006-12-05 |
| Pb-free solder-connected structure and electronic device App 20060115994 - Shimokawa; Hanae ; et al. | 2006-06-01 |
| Method of producing an electronic device having a PB free solder connection Grant 7,013,564 - Shimokawa , et al. March 21, 2 | 2006-03-21 |
| Pb-free solder-connected structure and electronic device Grant 6,960,396 - Shimokawa , et al. November 1, 2 | 2005-11-01 |
| Electronic device Grant 6,774,490 - Soga , et al. August 10, 2 | 2004-08-10 |
| Electron device and semiconductor device App 20030186072 - Soga, Tasao ; et al. | 2003-10-02 |
| Electron device and semiconductor device Grant 6,555,052 - Soga , et al. April 29, 2 | 2003-04-29 |
| Semiconductor device having solder bumps reliably reflow solderable App 20030030149 - Miura, Kazuma ; et al. | 2003-02-13 |
| Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate Grant 6,486,411 - Miura , et al. November 26, 2 | 2002-11-26 |
| Electronic device App 20020171157 - Soga, Tasao ; et al. | 2002-11-21 |
| Pb-free solder-connected structure and electronic device App 20020163085 - Shimokawa, Hanae ; et al. | 2002-11-07 |
| Electronic device App 20020114726 - Soga, Tasao ; et al. | 2002-08-22 |
| Electronic device App 20020100986 - Soga, Tasao ; et al. | 2002-08-01 |
| Electron device and semiconductor device App 20020066583 - Soga, Tasao ; et al. | 2002-06-06 |
| Pb-free solder-connected structure and electronic device App 20020019077 - Shimokawa, Hanae ; et al. | 2002-02-14 |
| Technical field App 20020009610 - Shimokawa, Hanae ; et al. | 2002-01-24 |
| Semiconductor module and circuit substrate App 20010050181 - Miura, Kazuma ; et al. | 2001-12-13 |
| Method and apparatus of manufacturing an electronic circuit board Grant 6,204,490 - Soga , et al. March 20, 2 | 2001-03-20 |
| Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same Grant 5,942,185 - Nakatsuka , et al. August 24, 1 | 1999-08-24 |
| Electric appliance, printed circuit board, remained life estimation method, and system thereof Grant 5,867,809 - Soga , et al. February 2, 1 | 1999-02-02 |
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