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Patent applications and USPTO patent grants for SHIMODA; Taro.The latest application filed is for "heat-curable silicone resin composition, optical semiconductor device and semiconductor package using molded product of same".
Patent | Date |
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Heat-curable Silicone Resin Composition, Optical Semiconductor Device And Semiconductor Package Using Molded Product Of Same App 20170088710 - TSUTSUMI; Yoshihiro ;   et al. | 2017-03-30 |
Set of resin compositions for preparing system-in-package type semiconductor device Grant 9,018,281 - Sumita , et al. April 28, 2 | 2015-04-28 |
Set Of Resin Compositions For Preparing System-in-package Type Semiconductor Device App 20120074596 - Sumita; Kazuaki ;   et al. | 2012-03-29 |
Set of resin compositions for preparing system-in-package type semiconductor device App 20080070054 - Sumita; Kazuaki ;   et al. | 2008-03-20 |
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