Shimoda; Kouhei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shimoda; Kouhei.The latest application filed is for "conductive adhesive and led substrate using the same".
- Shimoda; Kouhei - Osaka JP
- Shimoda; Kouhei - Itami JP
- Shimoda; Kouhei - Hyogo JP
- Shimoda, Kouhei - Itami-shi JP
| Patent | Date |
|---|---|
| Conductive Adhesive And Led Substrate Using The Same App 20110140162 - Okada; Issei ; et al. | 2011-06-16 |
| Exhaust emission control device and method of manufacturing the same Grant 6,939,824 - Shimoda , et al. September 6, 2 | 2005-09-06 |
| Aluminium nitride ceramics and method for preparing the same Grant 6,696,103 - Shimoda , et al. February 24, 2 | 2004-02-24 |
| Exhaust emission control device and method of manufacturing the same App 20010028867 - Shimoda, Kouhei ; et al. | 2001-10-11 |
| Metallized ceramic substrate having smooth plating layer and method for producing the same Grant 5,679,469 - Shimoda , et al. October 21, 1 | 1997-10-21 |
| Heat conductive colored aluminum nitride sintered body Grant 5,306,679 - Shimoda , et al. * April 26, 1 | 1994-04-26 |
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