loadpatents
Patent applications and USPTO patent grants for Shimoda; Kohei.The latest application filed is for "metal catalyst and method for production thereof".
Patent | Date |
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Metal coating, forming method thereof, and metal wiring Grant 8,507,104 - Okada , et al. August 13, 2 | 2013-08-13 |
Method for manufacturing electronic circuit component Grant 8,026,185 - Maeda , et al. September 27, 2 | 2011-09-27 |
Conductive paste and wiring board using it Grant 8,007,690 - Yamakawa , et al. August 30, 2 | 2011-08-30 |
Metal catalyst and method for production thereof Grant 7,915,190 - Majima , et al. March 29, 2 | 2011-03-29 |
Metal catalyst and method for production thereof Grant 7,803,734 - Majima , et al. September 28, 2 | 2010-09-28 |
Metal Catalyst And Method For Production Thereof App 20100184586 - MAJIMA; Masatoshi ;   et al. | 2010-07-22 |
Granular metal powder Grant 7,691,175 - Shimoda , et al. April 6, 2 | 2010-04-06 |
Method For Manufacturing Electronic Circuit Component App 20100003791 - Maeda; Shinichi ;   et al. | 2010-01-07 |
Metallic colloidal solution and inkjet-use metallic ink Grant 7,608,203 - Okada , et al. October 27, 2 | 2009-10-27 |
Metal coating, forming method thereof, and metal wiring App 20090197045 - Okada; Issei ;   et al. | 2009-08-06 |
Electrically conductive pastes Grant 7,556,747 - Yamakawa , et al. July 7, 2 | 2009-07-07 |
Conductive Paste and Wiring Board Using It App 20090107707 - Yamakawa; Masahiro ;   et al. | 2009-04-30 |
Method of producing metal powder Grant 7,510,592 - Majima , et al. March 31, 2 | 2009-03-31 |
Metallic Colloidal Solution And Inkjet-use Metallic Ink App 20080308001 - OKADA; Issei ;   et al. | 2008-12-18 |
Metallic colloidal solution and inkjet-use metallic ink Grant 7,445,731 - Okada , et al. November 4, 2 | 2008-11-04 |
Method of manufacturing chain-structure metal powder Grant 7,285,152 - Shimoda , et al. October 23, 2 | 2007-10-23 |
Metal Catalyst and Method for Production Thereof App 20070244003 - Majima; Masatoshi ;   et al. | 2007-10-18 |
Method of producing metal powder App 20070089565 - Majima; Masatoshi ;   et al. | 2007-04-26 |
Granular metal powder App 20070074598 - Shimoda; Kohei ;   et al. | 2007-04-05 |
Conductive silver paste and conductive film formed using the same Grant 7,198,736 - Kasuga , et al. April 3, 2 | 2007-04-03 |
Method of forming a conductive wiring pattern by laser irradiation and a conductive wiring pattern App 20060057502 - Okada; Issei ;   et al. | 2006-03-16 |
Conductive silver paste and conductive film formed using the same App 20050194577 - Kasuga, Takashi ;   et al. | 2005-09-08 |
Metallic colloidal solution and inkjet-use metallic ink App 20050189520 - Okada, Issei ;   et al. | 2005-09-01 |
Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material App 20040221683 - Shimoda, Kohei ;   et al. | 2004-11-11 |
Particulate filter Grant 6,776,815 - Kato , et al. August 17, 2 | 2004-08-17 |
Nonwoven metal fabric and method of making same Grant 6,585,794 - Shimoda , et al. July 1, 2 | 2003-07-01 |
Particulate filter App 20020157361 - Kato, Zenichiro ;   et al. | 2002-10-31 |
Nonwoven metal fabric and method of making same App 20020078669 - Shimoda, Kohei ;   et al. | 2002-06-27 |
Aluminum nitride sintered body and process for producing the same Grant 5,312,786 - Yamakawa , et al. May 17, 1 | 1994-05-17 |
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