Shimoda; Keiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shimoda; Keiichi.The latest application filed is for "method of cleaning a substrate processing apparatus and the substrate processing apparatus performing the method".
- Shimoda; Keiichi - Miyagi JP
- Shimoda; Keiichi - Beaverton OR
- SHIMODA; Keiichi - Kurokawa-gun Miyagi
- Shimoda; Keiichi - Saitama JP
| Patent | Date |
|---|---|
| Method of cleaning plasma processing apparatus Grant 10,975,468 - Kishi , et al. April 13, 2 | 2021-04-13 |
| Method of cleaning a substrate processing apparatus and the substrate processing apparatus performing the method Grant 10,944,051 - Kubo , et al. March 9, 2 | 2021-03-09 |
| Method Of Cleaning A Substrate Processing Apparatus And The Substrate Processing Apparatus Performing The Method App 20190355901 - KUBO; Takuya ; et al. | 2019-11-21 |
| Method of cleaning and method of plasma processing Grant 10,403,814 - Kubo , et al. Sep | 2019-09-03 |
| Method Of Cleaning Plasma Processing Apparatus App 20180327901 - KISHI; Hiroki ; et al. | 2018-11-15 |
| Method Of Cleaning And Method Of Plasma Processing App 20180301622 - KUBO; Takuya ; et al. | 2018-10-18 |
| Method of cleaning plasma processing apparatus Grant 10,053,773 - Kishi , et al. August 21, 2 | 2018-08-21 |
| Method for etching copper layer Grant 9,803,286 - Nishimura , et al. October 31, 2 | 2017-10-31 |
| Method for etching layer to be etched Grant 9,647,206 - Hashimoto , et al. May 9, 2 | 2017-05-09 |
| Method For Etching Layer To Be Etched App 20160276582 - HASHIMOTO; Mitsuru ; et al. | 2016-09-22 |
| Method Of Cleaning Plasma Processing Apparatus App 20150247235 - KISHI; Hiroki ; et al. | 2015-09-03 |
| Method For Etching Copper Layer App 20150104951 - NISHIMURA; Eiichi ; et al. | 2015-04-16 |
| Fluorosilicone release agent composition Grant 5,356,719 - Hamada , et al. October 18, 1 | 1994-10-18 |
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