Shimo-Ohsako; Kanji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shimo-Ohsako; Kanji.The latest application filed is for "thermosetting resin composition, and laminate and circuit substrate using same".
- Shimo-Ohsako; Kanji - Settsu JP
- Shimo-Ohsako; Kanji - Osaka JP
- Shimo-Ohsako; Kanji - Settsu-shi JP
| Patent | Date |
|---|---|
| Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same Grant 8,313,831 - Tanaka , et al. November 20, 2 | 2012-11-20 |
| Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same App 20080312383 - Tanaka; Shigeru ; et al. | 2008-12-18 |
| Resin composition Grant 7,115,681 - Shimo-Ohsako , et al. October 3, 2 | 2006-10-03 |
| Laminate Grant 7,101,619 - Nishinaka , et al. September 5, 2 | 2006-09-05 |
| Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same App 20060115670 - Tanaka; Shigeru ; et al. | 2006-06-01 |
| Laminate App 20050221080 - Nishinaka, Masaru ; et al. | 2005-10-06 |
| Laminate Grant 6,911,265 - Nishinaka , et al. June 28, 2 | 2005-06-28 |
| Thermosetting resin composition and laminates and circuit board substrates made by using the same App 20050119381 - Tanaka, Shigeru ; et al. | 2005-06-02 |
| Laminate and its producing method App 20040231141 - Nishinaka, Masaru ; et al. | 2004-11-25 |
| Resin composition App 20040176526 - Shimo-Ohsako, Kanji ; et al. | 2004-09-09 |
| Laminate App 20030113521 - Nishinaka, Masaru ; et al. | 2003-06-19 |
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