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name:-0.005774974822998
name:-0.004845142364502
Shimizu; Shumpei Patent Filings

Shimizu; Shumpei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shimizu; Shumpei.The latest application filed is for "copper-based metal polishing composition, method for manufacturing a semiconductor device, polishing composition, aluminum-based metal polishing composition, and tungsten-based metal polishing composition".

Company Profile
0.5.1
  • Shimizu; Shumpei - Kawasaki JP
  • Shimizu, Shumpei - Kawasaki-shi JP
  • Shimizu; Shumpei - Tokyo JP
  • Shimizu; Shumpei - Moses Lake WA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

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