SHIMIZU, MITSUHARU

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIMIZU, MITSUHARU.The latest application filed is for "semiconductor device having external connecting terminals and process for manufacturing the device".

Company Profile

0.11.2

SHIMIZU, MITSUHARU - NAGANO-SHI JP
Shimizu; Mitsuharu - Nagano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Having External Connecting Terminals And Process For Manufacturing The Device App 20030107131 - HIGASHI, MITSUTOSHI ; et al.	2003-06-12
Semiconductor device having external connecting terminals and process for manufacturing the device App 20010028108 - Higashi, Mitsutoshi ; et al.	2001-10-11
Method for producing a semiconductor package Grant 6,074,567 - Kuraishi , et al. June 13, 2	2000-06-13
Process for producing a semiconductor package Grant 5,804,422 - Shimizu , et al. September 8, 1	1998-09-08
Process for manufacturing a multi-layer lead frame Grant RE35,353 - Tokita , et al. October 22, 1	1996-10-22
Metal plane support for multi-layer lead frames and a process for manufacturing such frames Grant 5,410,180 - Fujii , et al. April 25, 1	1995-04-25
Multi-layer lead frame using a metal-core substrate Grant 5,389,816 - Shimizu , et al. February 14, 1	1995-02-14
Lead frame and semiconductor device using same Grant 5,291,060 - Shimizu , et al. March 1, 1	1994-03-01
Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane Grant 5,281,556 - Shimizu , et al. January 25, 1	1994-01-25
Lead frame and semiconductor device using same Grant 5,237,202 - Shimizu , et al. August 17, 1	1993-08-17
Multi-layer lead frame for a semiconductor device with contact geometry Grant 5,235,209 - Shimizu , et al. August 10, 1	1993-08-10
Process for manufacturing a multi-layer lead frame Grant 5,231,756 - Tokita , et al. August 3, 1	1993-08-03
Semiconductor device using a tape carrier Grant 5,070,390 - Shimizu December 3, 1	1991-12-03

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