loadpatents
Patent applications and USPTO patent grants for Shimizu; Kazumichi.The latest application filed is for "image forming apparatus".
Patent | Date |
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Battery and method for producing the same Grant 11,456,513 - Shimizu , et al. September 27, 2 | 2022-09-27 |
Image Forming Apparatus App 20220283525 - Shimizu; Kazumichi | 2022-09-08 |
Battery App 20220149466 - SHIMIZU; KOTA ;   et al. | 2022-05-12 |
Battery And Manufacturing Method For Battery App 20220131240 - SHIMIZU; KAZUMICHI | 2022-04-28 |
Battery App 20220123395 - KOHIRA; Kazutoshi ;   et al. | 2022-04-21 |
Battery And Method For Producing Same App 20220102789 - SHIMIZU; Kazumichi ;   et al. | 2022-03-31 |
Battery App 20220037723 - KOHIRA; KAZUTOSHI ;   et al. | 2022-02-03 |
Laser Welding Method And Apparatus App 20210394305 - FUNAMI; KOJI ;   et al. | 2021-12-23 |
Sealed cell and method for manufacturing same Grant 11,139,519 - Tominaga , et al. October 5, 2 | 2021-10-05 |
Battery Grant D920,900 - Ueda , et al. June 1, 2 | 2021-06-01 |
Battery Grant D920,902 - Ueda , et al. June 1, 2 | 2021-06-01 |
Battery Grant D920,901 - Ueda , et al. June 1, 2 | 2021-06-01 |
Battery And Method For Producing The Same App 20210151837 - Shimizu; Kazumichi ;   et al. | 2021-05-20 |
Battery And Method For Manufacturing Same App 20210126289 - HATTORI; Sadahiro ;   et al. | 2021-04-29 |
Cylindrical Battery And Method Of Manufacturing Same App 20210066697 - Yokoo; Ryunosuke ;   et al. | 2021-03-04 |
Adhesive tape application device, line member connection device including adhesive tape application device, adhesive tape application method, and line member connection method including adhesive tape application method Grant 10,752,461 - Shimizu , et al. A | 2020-08-25 |
Sealed Cell And Method For Manufacturing Same App 20200259133 - A1 | 2020-08-13 |
Image forming apparatus Grant 10,698,353 - Shimizu , et al. | 2020-06-30 |
Cylindrical Battery And Method Of Manufacture Thereof App 20200176750 - FUNAMI; KOJI ;   et al. | 2020-06-04 |
Image Forming Apparatus App 20180024486 - Shimizu; Kazumichi ;   et al. | 2018-01-25 |
Adhesive Tape Application Device, Line Member Connection Device Including Adhesive Tape Application Device, Adhesive Tape Application Method, And Line Member Connection Method Including Adhesive Tape Application Method App 20150217963 - SHIMIZU; Kazumichi ;   et al. | 2015-08-06 |
Image forming apparatus having developer stirring control Grant 8,977,152 - Shimizu March 10, 2 | 2015-03-10 |
Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus Grant 8,895,359 - Tomura , et al. November 25, 2 | 2014-11-25 |
Solar Cell Module App 20140209164 - KUDOH; YOSHIYUKI ;   et al. | 2014-07-31 |
Image Forming Apparatus App 20130223862 - Shimizu; Kazumichi | 2013-08-29 |
Semiconductor device and method of manufacturing the same Grant 8,207,618 - Shimizu , et al. June 26, 2 | 2012-06-26 |
Semiconductor Device, Flip-chip Mounting Method And Flip-chip Mounting Apparatus App 20110175237 - Tomura; Yoshihiro ;   et al. | 2011-07-21 |
Bare chip mounted structure and mounting method Grant 7,907,420 - Nagai , et al. March 15, 2 | 2011-03-15 |
Semiconductor Device And Method Of Manufacturing The Same App 20100187675 - Shimizu; Kazumichi ;   et al. | 2010-07-29 |
Bare Chip Mounted Structure and Mounting Method App 20080192423 - Nagai; Koichi ;   et al. | 2008-08-14 |
Electronic parts packaging method and electronic parts package Grant 7,355,126 - Nishikawa , et al. April 8, 2 | 2008-04-08 |
Method for mounting a semiconductor element to an interposer by compression bonding Grant 7,060,528 - Nishikawa , et al. June 13, 2 | 2006-06-13 |
High manganese cast iron containing spheroidal vanadium carbide and method for making therof Grant 6,908,589 - Kitudo , et al. June 21, 2 | 2005-06-21 |
High manganese cast iron containing spheroidal vanadium carbide and method for making thereof App 20040151612 - Kitudo, Tadashi ;   et al. | 2004-08-05 |
Semiconductor element mounting method App 20030166313 - Nishikawa, Hidenobu ;   et al. | 2003-09-04 |
Electronic parts packaging method and electronic parts package App 20030092326 - Nishikawa, Hidenobu ;   et al. | 2003-05-15 |
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