SHIMIZU; Junichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIMIZU; Junichiro.The latest application filed is for "optical semiconductor integrated device, method of manufacturing optical semiconductor integrated device, and optical communicat".

Company Profile

1.18.15

SHIMIZU; Junichiro - Tokyo JP
Shimizu; Junichiro - Fujisawa JP
Shimizu; Junichiro - Hadano N/A JP
SHIMIZU; Junichiro - Toyko JP
Shimizu; Junichiro - Hino JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical Semiconductor Integrated Device, Method Of Manufacturing Optical Semiconductor Integrated Device, And Optical Communicat App 20190165541 - WATANABE; Isao ; et al.	2019-05-30
High frequency magnetic field assisted magnetic recording head Grant 9,007,722 - Shimizu , et al. April 14, 2	2015-04-14
Microwave-assisted magnetic recording head Grant 9,001,465 - Shimizu , et al. April 7, 2	2015-04-07
High frequency magnetic field assisted magnetic recording head, and method of manufacturing same Grant 8,917,481 - Kusukawa , et al. December 23, 2	2014-12-23
High Frequency Magnetic Field Assisted Magnetic Recording Head, And Method Of Manufacturing Same App 20140313616 - KUSUKAWA; Kikuo ; et al.	2014-10-23
High Frequency Magnetic Field Assisted Magnetic Recording Head App 20140063658 - SHIMIZU; Junichiro ; et al.	2014-03-06
Thermally-assisted recording head and magnetic recording system Grant 8,547,804 - Shimizu October 1, 2	2013-10-01
Thermally assisted magnetic head assembly and magnetic disk device Grant 8,477,570 - Arai , et al. July 2, 2	2013-07-02
Thermal-assisted-magnetic-recording head having a high refractive index core and multiple thin film cores, and magnetic recording system using the thermal-assisted-magnetic-recording head Grant 8,406,093 - Iwanabe , et al. March 26, 2	2013-03-26
Thermally Assisted Magnetic Head Assembly and Magnetic Disk Device App 20120320719 - Arai; Satoshi ; et al.	2012-12-20
Thermally-assisted magnetic recording head Grant 8,300,503 - Arai , et al. October 30, 2	2012-10-30
Thermally assisted magnetic recording head and head assembly Grant 8,270,262 - Naniwa , et al. September 18, 2	2012-09-18
Thermally-assisted Recording Head And Magnetic Recording System App 20120051195 - SHIMIZU; Junichiro	2012-03-01
Thermally assisted magnetic recording head and magnetic recording apparatus Grant 8,054,571 - Matsumoto , et al. November 8, 2	2011-11-08
Thermally Assisted Magnetic Recording Head And Head Assembly App 20110149698 - Naniwa; Irizo ; et al.	2011-06-23
Thermally-Assisted Magnetic Recording Head App 20110141862 - Arai; Satoshi ; et al.	2011-06-16
Thermal-assisted-magnetic-recording Head And Magnetic Recording System Using The Thermal-assisted-magnetic-recoring Head App 20110090770 - IWANABE; Yasuhiko ; et al.	2011-04-21
Optical device integrated head Grant 7,921,436 - Shimizu , et al. April 5, 2	2011-04-05
Thermally assisted magnetic recording head and magnetic recording apparatus Grant 7,898,759 - Matsumoto , et al. March 1, 2	2011-03-01
Thermally Assisted Magnetic Recording Head And Magnetic Recording Apparatus App 20110038235 - Matsumoto; Takuya ; et al.	2011-02-17
Recording head Grant 7,864,635 - Shimizu January 4, 2	2011-01-04
Semiconductor Lasers App 20100111126 - Shimizu; Junichiro ; et al.	2010-05-06
Optical Device Integrated Head App 20080316872 - SHIMIZU; Junichiro ; et al.	2008-12-25
Thermally Assisted Magnetic Recording Head And Magnetic Recording Apparatus App 20080204916 - MATSUMOTO; Takuya ; et al.	2008-08-28
Recording Head App 20080056073 - Shimizu; Junichiro	2008-03-06
Optical module device driven by a single power supply Grant 7,199,441 - Shimizu , et al. April 3, 2	2007-04-03
Optical module device App 20050275053 - Shimizu, Junichiro ; et al.	2005-12-15
Module for optical communications Grant 6,826,212 - Shirai , et al. November 30, 2	2004-11-30
Module for optical communications App 20020118713 - Shirai, Masataka ; et al.	2002-08-29
Method of manufacturing semiconductor device with copper core bumps Grant 5,433,822 - Mimura , et al. July 18, 1	1995-07-18

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