Shimayama; Yuichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shimayama; Yuichi.The latest application filed is for "prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate".

Company Profile

1.8.7

Shimayama; Yuichi - Tokyo JP
SHIMAYAMA; Yuichi - Chiyoda-ku Tokyo
Shimayama; Yuichi - Shimotsuke JP
SHIMAYAMA; Yuichi - Shimotsuke-shi JP
Shimayama; Yuichi - Yuki JP
Shimayama; Yuichi - Ibaraki JP
Shimayama; Yuichi - Shimodate JP
Shimayama; Yuichi - Shimodate-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar Grant 11,286,346 - Tanigawa , et al. March 29, 2	2022-03-29
Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate Grant 11,214,660 - Yoshida , et al. January 4, 2	2022-01-04
Prepreg, Laminate, Printed Wiring Board, Coreless Substrate, Semiconductor Package And Method For Producing Coreless Substrate App 20200239653 - YOSHIDA; Yuma ; et al.	2020-07-30
Resin Composition, Support With Resin Layer, Prepreg, Laminate, Multilayered Printed Wiring Board, And Printed Wiring Board For Millimeter-wave Radar App 20180002485 - TANIGAWA; Takao ; et al.	2018-01-04
Antenna beam scan module, and communication apparatus using the same Grant 9,620,865 - Nagaishi , et al. April 11, 2	2017-04-11
Antenna beam scan unit and wireless communication system using antenna beam scan unit Grant 8,644,367 - Nagaishi , et al. February 4, 2	2014-02-04
Antenna Beam Scan Module, And Communication Apparatus Using The Same App 20130214974 - NAGAISHI; Hideyuki ; et al.	2013-08-22
Antenna Beam Scan Unit And Wireless Communication System Using Antenna Beam Scan Unit App 20120257653 - NAGAISHI; Hideyuki ; et al.	2012-10-11
Triplate line-to-waveguide transducer having spacer dimensions which are larger than waveguide dimensions Grant 8,188,805 - Nomura , et al. May 29, 2	2012-05-29
Triplate Line-to-waveguide Transducer App 20100085133 - Nomura; Taketo ; et al.	2010-04-08
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device Grant 7,592,250 - Shimada , et al. September 22, 2	2009-09-22
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device Grant 7,239,013 - Shimada , et al. July 3, 2	2007-07-03
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device App 20070108588 - Shimada; Yasushi ; et al.	2007-05-17
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device App 20060063367 - Shimada; Yasushi ; et al.	2006-03-23

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