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Patent applications and USPTO patent grants for Shimadu; Hitoshi.The latest application filed is for "substrate and metal layer manufacturing method".
Patent | Date |
---|---|
Substrate and metal layer manufacturing method Grant 9,693,456 - Ozaki , et al. June 27, 2 | 2017-06-27 |
Substrate Grant 9,655,240 - Ozaki , et al. May 16, 2 | 2017-05-16 |
Wiring board and method for manufacturing wiring board Grant 9,332,638 - Ozaki , et al. May 3, 2 | 2016-05-03 |
Substrate And Metal Layer Manufacturing Method App 20150351239 - OZAKI; Kiminori ;   et al. | 2015-12-03 |
Module For Facilitating Positioning Of Electronic Components App 20150289375 - Ozaki; Kiminori ;   et al. | 2015-10-08 |
SUBSTRATE (As Amended) App 20150289371 - Ozaki; Kiminori ;   et al. | 2015-10-08 |
Wiring substrate and manufacturing method for wiring substrate Grant 9,084,371 - Shimadu , et al. July 14, 2 | 2015-07-14 |
Wiring board Grant 8,963,672 - Asano , et al. February 24, 2 | 2015-02-24 |
Circuit board production method and circuit board Grant 8,917,495 - Shimadu , et al. December 23, 2 | 2014-12-23 |
Circuit Board, And Manufacturing Method For Circuit Board App 20140251659 - Asano; Hiroaki ;   et al. | 2014-09-11 |
Multi-layer Wiring Board And Method For Producing Multi-layer Wiring Board App 20140226296 - Asano; Hiroaki ;   et al. | 2014-08-14 |
Wiring Board And Method For Manufacturing Wiring Board App 20140151106 - Ozaki; Kiminori ;   et al. | 2014-06-05 |
Wiring Board App 20140139310 - Asano; Hiroaki ;   et al. | 2014-05-22 |
Electronic unit Grant 8,686,823 - Asano , et al. April 1, 2 | 2014-04-01 |
Wiring Substrate App 20140027170 - Shimadu; Hitoshi ;   et al. | 2014-01-30 |
Electronic Unit App 20120195005 - ASANO; Hiroaki ;   et al. | 2012-08-02 |
Circuit Board Production Method And Circuit Board App 20120160553 - Shimadu; Hitoshi ;   et al. | 2012-06-28 |
Wiring Substrate And Manufacturing Method For Wiring Substrate App 20120119868 - Shimadu; Hitoshi ;   et al. | 2012-05-17 |
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