Shimadu; Hitoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shimadu; Hitoshi.The latest application filed is for "substrate and metal layer manufacturing method".
- Shimadu; Hitoshi - Kariya JP
- SHIMADU; Hitoshi - Kariya-shi JP
- Shimadu; Hitoshi - Obu N/A JP
- Shimadu; Hitoshi - Higashiura-cho JP
- Shimadu; Hitoshi - Aichi-ken N/A JP
- SHIMADU; Hitoshi - US
- Shimadu; Hitoshi - Chita-gun Higashiura-cho JP
- Shimadu; Hitoshi - Obu-shi JP
| Patent | Date |
|---|---|
| Substrate and metal layer manufacturing method Grant 9,693,456 - Ozaki , et al. June 27, 2 | 2017-06-27 |
| Substrate Grant 9,655,240 - Ozaki , et al. May 16, 2 | 2017-05-16 |
| Wiring board and method for manufacturing wiring board Grant 9,332,638 - Ozaki , et al. May 3, 2 | 2016-05-03 |
| Substrate And Metal Layer Manufacturing Method App 20150351239 - OZAKI; Kiminori ; et al. | 2015-12-03 |
| Module For Facilitating Positioning Of Electronic Components App 20150289375 - Ozaki; Kiminori ; et al. | 2015-10-08 |
| SUBSTRATE (As Amended) App 20150289371 - Ozaki; Kiminori ; et al. | 2015-10-08 |
| Wiring substrate and manufacturing method for wiring substrate Grant 9,084,371 - Shimadu , et al. July 14, 2 | 2015-07-14 |
| Wiring board Grant 8,963,672 - Asano , et al. February 24, 2 | 2015-02-24 |
| Circuit board production method and circuit board Grant 8,917,495 - Shimadu , et al. December 23, 2 | 2014-12-23 |
| Circuit Board, And Manufacturing Method For Circuit Board App 20140251659 - Asano; Hiroaki ; et al. | 2014-09-11 |
| Multi-layer Wiring Board And Method For Producing Multi-layer Wiring Board App 20140226296 - Asano; Hiroaki ; et al. | 2014-08-14 |
| Wiring Board And Method For Manufacturing Wiring Board App 20140151106 - Ozaki; Kiminori ; et al. | 2014-06-05 |
| Wiring Board App 20140139310 - Asano; Hiroaki ; et al. | 2014-05-22 |
| Electronic unit Grant 8,686,823 - Asano , et al. April 1, 2 | 2014-04-01 |
| Wiring Substrate App 20140027170 - Shimadu; Hitoshi ; et al. | 2014-01-30 |
| Electronic Unit App 20120195005 - ASANO; Hiroaki ; et al. | 2012-08-02 |
| Circuit Board Production Method And Circuit Board App 20120160553 - Shimadu; Hitoshi ; et al. | 2012-06-28 |
| Wiring Substrate And Manufacturing Method For Wiring Substrate App 20120119868 - Shimadu; Hitoshi ; et al. | 2012-05-17 |
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