Shimada; Yuzo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shimada; Yuzo.The latest application filed is for "electric conduction heating device".

Company Profile

0.33.20

Shimada; Yuzo - Osaka JP
Shimada; Yuzo - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electric conduction heating device App 20090250453 - Okada; Tamio ; et al.	2009-10-08
Three-axis motion table Grant 7,263,897 - Shimada , et al. September 4, 2	2007-09-04
Three-axis motion table App 20060293795 - Shimada; Yuzo ; et al.	2006-12-28
Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk Grant 7,106,426 - Kikuchi , et al. September 12, 2	2006-09-12
Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board Grant 6,999,643 - Kikuchi , et al. February 14, 2	2006-02-14
Semiconductor device with decoupling capacitors mounted on conductors Grant 6,949,815 - Yamazaki , et al. September 27, 2	2005-09-27
Optical waveguide board and optical module Grant 6,934,429 - Kikuchi , et al. August 23, 2	2005-08-23
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip Grant 6,926,188 - Hazeyama , et al. August 9, 2	2005-08-09
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip Grant 6,889,886 - Hazeyama , et al. May 10, 2	2005-05-10
Optical path control apparatus with mirror section, and manufacturing method for the same Grant 6,829,079 - Oda , et al. December 7, 2	2004-12-07
Semiconductor device and method for packaging same App 20040135264 - Yamazaki, Takao ; et al.	2004-07-15
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip App 20040094601 - Hazeyama, Ichiro ; et al.	2004-05-20
Semiconductor device and method for packaging same Grant 6,703,705 - Yamazaki , et al. March 9, 2	2004-03-09
Semiconductor device packaging structure Grant 6,670,699 - Mikubo , et al. December 30, 2	2003-12-30
Optical waveguide board and optical module App 20030142896 - Kikuchi, Hideo ; et al.	2003-07-31
Method of manufacturing optical waveguide and method of manufacturing OPTO-electric wiring board App 20030128907 - Kikuchi, Hideo ; et al.	2003-07-10
Optical path control apparatus with mirror section, and manufacturing method for the same App 20030117690 - Oda, Mikio ; et al.	2003-06-26
Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk App 20030117614 - Kikuchi, Hideo ; et al.	2003-06-26
Photo-electric combined substrate App 20030053765 - Oda, Mikio ; et al.	2003-03-20
Semiconductor device, and thin film capacitor Grant 6,524,905 - Yamamichi , et al. February 25, 2	2003-02-25
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same Grant 6,515,324 - Shibuya , et al. February 4, 2	2003-02-04
Semiconductor device packaging structure App 20020185718 - Mikubo, Kazuyuki ; et al.	2002-12-12
Photo-electric combined substrate, optical waveguide and manufacturing process therefor Grant 6,477,284 - Oda , et al. November 5, 2	2002-11-05
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip App 20020135064 - Hazeyama, Ichiro ; et al.	2002-09-26
Semiconductor device and method for packaging same App 20020074643 - Yamazaki, Takao ; et al.	2002-06-20
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same App 20020070400 - Shibuya, Akinobu ; et al.	2002-06-13
Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied thereto App 20020056922 - Funaya, Takuo ; et al.	2002-05-16
Semiconductor device, manufacturing method therefor, and thin film capacitor App 20020025623 - Yamamichi, Shintaro ; et al.	2002-02-28
Three-dimensional semiconductor device and method of manufacturing the same App 20020022303 - Senba, Naoji ; et al.	2002-02-21
Multilayer capacitor, semiconductor device, and electrical circuit board App 20020017700 - Mori, Toru ; et al.	2002-02-14
Semiconductor device and method of fabricating the same App 20010054762 - Yamazaki, Takao ; et al.	2001-12-27
Apparatus for transferring micro-balls App 20010015372 - Yamamoto, Takumi ; et al.	2001-08-23
Method and apparatus for lining up micro-balls App 20010009261 - Yamamoto, Takumi ; et al.	2001-07-26
Semiconductor packing stack module and method of producing the same Grant 6,188,127 - Senba , et al. February 13, 2	2001-02-13
Packaged semiconductor device and method of manufacturing the same Grant 6,130,111 - Ikuina , et al. October 10, 2	2000-10-10
Laminate printed circuit board with a magnetic layer Grant 6,111,479 - Myohga , et al. August 29, 2	2000-08-29
Solder ball arrangement device Grant 6,095,398 - Takahashi , et al. August 1, 2	2000-08-01
Printed wiring board with integrated coil inductor Grant 5,978,231 - Tohya , et al. November 2, 1	1999-11-02
Method for arranging minute metallic balls Grant 5,976,965 - Takahashi , et al. November 2, 1	1999-11-02
Stacked carrier three-dimensional memory module and semiconductor device using the same Grant 5,973,392 - Senba , et al. October 26, 1	1999-10-26
Packaged semiconductor device and method of manufacturing the same Grant 5,952,712 - Ikuina , et al. September 14, 1	1999-09-14
Supporting member for cooling means and electronic package using the same Grant 5,838,064 - Shimada , et al. November 17, 1	1998-11-17
Interconnection structures and method of making same Grant 5,830,563 - Shimoto , et al. November 3, 1	1998-11-03
Seal structure for tape carrier package Grant 5,814,882 - Shimada , et al. September 29, 1	1998-09-29
Supporting member for cooling means, electronic package and method of making the same Grant 5,814,535 - Shimada , et al. September 29, 1	1998-09-29
Semiconductor device and method of fabricating the same Grant 5,793,117 - Shimada , et al. August 11, 1	1998-08-11
Process for connecting electronic devices Grant 5,699,610 - Shimada , et al. December 23, 1	1997-12-23
Ceramic substrate having wiring of silver series Grant 5,292,574 - Kata , et al. March 8, 1	1994-03-08
Process for manufacturing a ceramic wiring substrate having a low dielectric constant Grant 5,283,081 - Kata , et al. February 1, 1	1994-02-01
Multi-layer circuit board having a large heat dissipation Grant 4,724,283 - Shimada , et al. February 9, 1	1988-02-09
MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate Grant 4,574,255 - Fujii , et al. March 4, 1	1986-03-04
Multilayer ceramic substrate with interlayered capacitor Grant 4,567,542 - Shimada , et al. January 28, 1	1986-01-28
Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material Grant 4,536,435 - Utsumi , et al. August 20, 1	1985-08-20

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