Shim; Seong Bo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shim; Seong Bo.The latest application filed is for "methods of forming semiconductors using etching effect predictions and methods for determining input parameters for semiconductor formation".

Company Profile

1.19.18

Shim; Seong Bo - Yongin-si KR
Shim; Seong Bo - Yongin-sin KR
Shim; Seong Bo - Seoul KR
Shim; Seong Bo - Kyoung-gi-Do KR
Shim; Seong-Bo - Suwon-si N/A KR
Shim; Seong Bo - Icheon N/A KR
Shim; Seong Bo - Icheon city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of forming semiconductors using etching effect predictions and methods for determining input parameters for semiconductor formation Grant 10,691,016 - Shim	2020-06-23
Methods Of Forming Semiconductors Using Etching Effect Predictions And Methods For Determining Input Parameters For Semiconductor Formation App 20190129297 - Shim; Seong Bo	2019-05-02
Printed circuit board and method for manufacturing same Grant 9,706,652 - Ryu , et al. July 11, 2	2017-07-11
Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding Grant 9,418,913 - Shim , et al. August 16, 2	2016-08-16
Printed circuit board and method for manufacturing same Grant 9,363,883 - Ryu , et al. June 7, 2	2016-06-07
Method and apparatus for measuring overlay Grant 8,860,953 - Shim , et al. October 14, 2	2014-10-14
Stackable integrated circuit package system Grant 8,779,570 - Shim , et al. July 15, 2	2014-07-15
Method for process proximity correction Grant 8,762,901 - Lee , et al. June 24, 2	2014-06-24
Printed Circuit Board And Method For Manufacturing Same App 20140000951 - Ryu; Sung Wuk ; et al.	2014-01-02
Printed Circuit Board And Method For Manufacturing Same App 20140000947 - Ryu; Sung Wuk ; et al.	2014-01-02
Method of manufacturing photo-mask Grant 8,614,034 - Moon , et al. December 24, 2	2013-12-24
Method For Process Proximity Correction App 20130219349 - LEE; WonChan ; et al.	2013-08-22
Method Of Designing A Photo Mask Layout App 20130219351 - SHIM; Seong-Bo	2013-08-22
Semiconductor Device and Method of Forming Insulating Layer on Conductive Traces for Electrical Isolation in Fine Pitch Bonding App 20130075900 - Shim; Seong Bo ; et al.	2013-03-28
Method of manufacturing semiconductor device by using uniform optical proximity correction Grant 8,392,854 - Kim , et al. March 5, 2	2013-03-05
Semiconductor apparatus including alignment tool Grant 8,355,139 - Shim January 15, 2	2013-01-15
Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding Grant 8,349,721 - Shim , et al. January 8, 2	2013-01-08
Package in package system incorporating an internal stiffener component Grant 8,288,205 - Shim , et al. October 16, 2	2012-10-16
Method Of Manufacturing Photo-mask App 20120208111 - MOON; Seong-ho ; et al.	2012-08-16
Methods And Apparatuses For Correcting A Mask Layout App 20120201447 - Shim; Seong-Bo	2012-08-09
Method And Apparatus For Measuring Overlay App 20120188543 - Shim; Seong-Bo ; et al.	2012-07-26
Method Of Manufacturing Semiconductor Device By Using Uniform Optical Proximity Correction App 20110265048 - KIM; Sang-wook ; et al.	2011-10-27
Method Of Performing Etch Proximity Correction, Method Of Forming Photomask Layout Using The Method, Computer-readable Recording Medium Storing Programmed Instructions For Executing The Method, And Mask Imaging System App 20110224945 - Shim; Seong-bo ; et al.	2011-09-15
Semiconductor Device and Method of Forming Insulating Layer on Conductive Traces for Electrical Isolation in Fine Pitch Bonding App 20110074026 - Shim; Seong Bo ; et al.	2011-03-31
Semiconductor Apparatus Including Alignment Tool App 20100214569 - Shim; Seong-Bo	2010-08-26
Stackable Integrated Circuit Package System App 20090236731 - Shim; Seong Bo ; et al.	2009-09-24
Package In Package System Incorporating An Internal Stiffener Component App 20090236719 - Shim; Seong Bo ; et al.	2009-09-24

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