loadpatents
name:-0.045979022979736
name:-0.044050931930542
name:-0.018265008926392
Shim; Jung Sup Patent Filings

Shim; Jung Sup

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shim; Jung Sup.The latest application filed is for "adhesive composition".

Company Profile
19.45.46
  • Shim; Jung Sup - Daejeon KR
  • Shim; Jung Sup - Yuseong-gu KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Pressure-sensitive adhesive composition
Grant 11,370,942 - Cho , et al. June 28, 2		2022-06-28
Adhesive composition
Grant 11,319,468 - Lee , et al. May 3, 2		2022-05-03
Adhesive composition
Grant 11,267,996 - Lee , et al. March 8, 2		2022-03-08
Adhesive composition
Grant 11,267,995 - Lee , et al. March 8, 2		2022-03-08
Adhesive and method of encapsulating organic electronic device using the same
Grant 11,142,669 - Yoo , et al. October 12, 2		2021-10-12
Organic electronic device
Grant 11,091,673 - Kim , et al. August 17, 2		2021-08-17
Adhesive composition
Grant 10,800,953 - Kim , et al. October 13, 2		2020-10-13
Adhesive Composition
App 20200277520 - Lee; Seung Min ;   et al.		2020-09-03
Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
Grant 10,752,814 - Park , et al. A		2020-08-25
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same
App 20200220091 - YOO; Hyun Jee ;   et al.		2020-07-09
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
Grant 10,683,440 - Cho , et al.		2020-06-16
Adhesive film
Grant 10,626,307 - Yoo , et al.		2020-04-21
Adhesive film and sealing product for organic electronic device using same
Grant 10,626,245 - Lee , et al.		2020-04-21
Adhesive and method of encapsulating organic electronic device using the same
Grant 10,622,573 - Yoo , et al.		2020-04-14
Pressure-sensitive Adhesive Composition
App 20190382632 - CHO; Yoon Gyung ;   et al.		2019-12-19
Adhesive Composition
App 20190359863 - Kim; So Young ;   et al.		2019-11-28
Curable composition
Grant 10,457,842 - Cho , et al. Oc		2019-10-29
Organic Electronic Device
App 20190322907 - KIM; So Young ;   et al.		2019-10-24
Pressure-sensitive adhesive composition
Grant 10,435,596 - Cho , et al. O		2019-10-08
Adhesive composition
Grant 10,421,887 - Kim , et al. Sept		2019-09-24
Pressure-sensitive Adhesive Composition, Pressure-sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device
App 20190241773 - Cho; Yoon Gyung ;   et al.		2019-08-08
Adhesive composition
Grant 10,351,736 - Kim , et al. July 16, 2		2019-07-16
Adhesive composition
Grant 10,336,919 - Shim , et al.		2019-07-02
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
Grant 10,308,842 - Cho , et al.		2019-06-04
Pressure Sensitive Adhesive Composition, Pressure Sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device Using The Same
App 20190127612 - PARK; Sang Min ;   et al.		2019-05-02
Adhesive film
Grant 10,227,514 - Yoo , et al.		2019-03-12
Adhesive Film And Sealing Product For Organic Electronic Device Using Same
App 20190071553 - LEE; Seung Min ;   et al.		2019-03-07
Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
Grant 10,202,525 - Park , et al. Feb		2019-02-12
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same
App 20180342687 - YOO; Hyun Jee ;   et al.		2018-11-29
Method for manufacturing electronic device
Grant 10,141,543 - Cho , et al. Nov		2018-11-27
Adhesive film and product for encapsulating organic electronic device using same
Grant 10,125,292 - Lee , et al. November 13, 2		2018-11-13
Adhesive film and sealing product for organic electronic device using same
Grant 10,093,785 - Lee , et al. October 9, 2		2018-10-09
Adhesive and method of encapsulating organic electronic device using the same
Grant 10,062,855 - Yoo , et al. August 28, 2		2018-08-28
Encapsulation composition (as amended)
Grant 10,050,204 - Lee , et al. August 14, 2		2018-08-14
Adhesive Film
App 20180223141 - YOO; Hyun Jee ;   et al.		2018-08-09
Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same
Grant 9,966,562 - Cho , et al. May 8, 2		2018-05-08
Adhesive Composition
App 20180118984 - LEE; Seung Min ;   et al.		2018-05-03
Encapsulant film
Grant 9,923,169 - Yoo , et al. March 20, 2		2018-03-20
Adhesive Composition
App 20180072919 - KIM; So Young ;   et al.		2018-03-15
Adhesive Composition
App 20180072925 - KIM; So Young ;   et al.		2018-03-15
Adhesive Composition
App 20180072927 - LEE; Seung Min ;   et al.		2018-03-15
Wafer processing base
Grant 9,905,450 - Kim , et al. February 27, 2		2018-02-27
Adhesive Composition
App 20180051193 - SHIM; Jung Sup ;   et al.		2018-02-22
Encapsulation film
Grant 9,806,293 - Yoo , et al. October 31, 2		2017-10-31
Composition for encapsulation film, encapsulation film, and electronic device comprising the same
Grant 9,768,386 - Shim , et al. September 19, 2		2017-09-19
Solventless composition and method for preparing the same
Grant 9,765,232 - Joo , et al. September 19, 2		2017-09-19
Encapsulation film
Grant 9,698,379 - Yoo , et al. July 4, 2		2017-07-04
Encapsulation film
Grant 9,698,378 - Cho , et al. July 4, 2		2017-07-04
Adhesive Composition, Adhesive Film, Brightness Enhancement Film, And Backlight Unit Comprising Same
App 20170146702 - WOO; Seung A ;   et al.		2017-05-25
Adhesive film and method of encapsulating organic electronic device
Grant 9,577,214 - Yoo , et al. February 21, 2		2017-02-21
Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said film
Grant 9,548,473 - Yoo , et al. January 17, 2		2017-01-17
Adhesive film
Grant 9,422,460 - Yoo , et al. August 23, 2		2016-08-23
Adhesive film
Grant 9,391,293 - Cho , et al. July 12, 2		2016-07-12
ENCAPSULANT FILM (As Amended)
App 20160155987 - YOO; Hyun Jee ;   et al.		2016-06-02
COMPOSITION FOR ENCAPSULATION FILM, ENCAPSULATION FILM, AND ELECTRONIC DEVICE COMPRISING THE SAME (As Amended)
App 20160149131 - SHIM; Jung Sup ;   et al.		2016-05-26
Adhesive film and sealing method for organic electronic device using same
Grant 9,343,697 - Shim , et al. May 17, 2		2016-05-17
Adhesive film and method for encapsulating organic electronic device using same
Grant 9,343,702 - Bae , et al. May 17, 2		2016-05-17
Method Of Evaluating Reliable Life Span Of Encapsulant Film And Device For Evaluating Reliability Of Said Film
App 20160131599 - YOO; Hyun Jee ;   et al.		2016-05-12
Substrate film and method of manufacturing the same
Grant 9,236,303 - Joo , et al. January 12, 2		2016-01-12
Pressure-sensitive Adhesive Composition, Pressure-sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device Using The Same
App 20150376468 - CHO; Yoon Gyung ;   et al.		2015-12-31
Curable Composition
App 20150368528 - CHO; Yoon Gyung ;   et al.		2015-12-24
Encapsulation Composition (as Amended)
App 20150357570 - LEE; Seung Min ;   et al.		2015-12-10
Pressure-sensitive Adhesive Composition
App 20150329747 - CHO; Yoon Gyung ;   et al.		2015-11-19
Pressure Sensitive Adhesive Composition, Pressure Sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device Using The Same
App 20150299523 - PARK; Sang Min ;   et al.		2015-10-22
Wafer processing sheet
Grant 9,165,815 - Kim , et al. October 20, 2		2015-10-20
Adhesive Film
App 20150284595 - YOO; Hyun Jee ;   et al.		2015-10-08
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same
App 20150287940 - YOO; Hyun Jee ;   et al.		2015-10-08
Adhesive and method of encapsulating organic electronic device using the same
Grant 9,105,648 - Yoo , et al. August 11, 2		2015-08-11
Encapsulation Film
App 20150188085 - YOO; Hyun Jee ;   et al.		2015-07-02
Adhesive Film And Method For Encapsulating Organic Electronic Device Using Same
App 20150144932 - BAE; Kyung Yul ;   et al.		2015-05-28
Method Of Manufacturing Organic Electronic Device
App 20150079726 - CHO; Yoon Gyung ;   et al.		2015-03-19
Adhesive Film And Sealing Method For Organic Electronic Device Using Same
App 20150060836 - SHIM; Jung Sup ;   et al.		2015-03-05
Adhesive Film And Sealing Product For Organic Electronic Device Using Same
App 20150048356 - LEE; Seung Min ;   et al.		2015-02-19
Adhesive Film And Product For Encapsulating Organic Electronic Device Using Same
App 20150034940 - LEE; Seung Min ;   et al.		2015-02-05
Pressure-sensitive Adhesive Composition
App 20140377554 - CHO; Yoon Gyung ;   et al.		2014-12-25
Photocurable Adhesive Film For Organic Electronic Device Seal, Organic Electronic Device, And Method For Sealing Same
App 20140319497 - CHO; Yoon Gyung ;   et al.		2014-10-30
Encapsulation Film
App 20140319999 - CHO; Yoon Gyung ;   et al.		2014-10-30
Method For Manufacturing Electornic Device
App 20140318707 - CHO; Yoon Gyung ;   et al.		2014-10-30
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same
App 20140264302 - YOO; Hyun Jee ;   et al.		2014-09-18
Encapsulation Film
App 20140217621 - YOO; Hyun Jee ;   et al.		2014-08-07
Adhesive film and method of encapsulating organic electrode device using the same
Grant 8,742,411 - Yoo , et al. June 3, 2		2014-06-03
Adhesive Film
App 20140110699 - Cho; Yoon Gyung ;   et al.		2014-04-24
Adhesive Film And Method Of Encapsulating Organic Electronic Device
App 20140091296 - YOO; Hyun Jee ;   et al.		2014-04-03
Solventless Composition And Method For Preparing The Same
App 20140044959 - JOO; Hyo Sook ;   et al.		2014-02-13
Substrate Film And Method Of Manufacturing The Same
App 20140045319 - JOO; Hyo Sook ;   et al.		2014-02-13
Adhesive Film
App 20130251989 - Yoo; Hyun Jee ;   et al.		2013-09-26
Adhesive Film And Method Of Encapsulating Organic Electrode Device Using The Same
App 20130240862 - Yoo; Hyun Jee ;   et al.		2013-09-19
Wafer Processing Base
App 20120202036 - KIM; Se Ra ;   et al.		2012-08-09
Wafer Processing Sheet
App 20120202337 - KIM; SE RA ;   et al.		2012-08-09

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