SHIM; Jung Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIM; Jung Jin.The latest application filed is for "thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same".

Company Profile

0.7.9

SHIM; Jung Jin - Daejeon KR
Shim; Jung-Jin - Pohang-si N/A KR
Shim; Jung-Jin - Gyeongsangbuk-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermosetting Resin Composition For Semiconductor Package And Prepreg And Metal Clad Laminate Using The Same App 20160369099 - MOON; Hwa Yeon ; et al.	2016-12-22
Thermosetting resin composition and prepreg and metal clad laminate using the same Grant 9,278,505 - Shim , et al. March 8, 2	2016-03-08
Thermosetting Resin Composition And Prepreg And Metal Clad Laminate Using The Same App 20130319609 - Shim; Hee-Yong ; et al.	2013-12-05
Alkali developable photosensitive resin composition and dry film manufactured by the same Grant 8,551,687 - Lee , et al. October 8, 2	2013-10-08
Metallic laminate and method for preparing the same Grant 8,426,029 - Kim , et al. April 23, 2	2013-04-23
Metallic Laminate And Method For Preparing The Same App 20120243186 - KIM; Byung-Nam ; et al.	2012-09-27
Metallic laminate and method for preparing the same Grant 8,221,842 - Kim , et al. July 17, 2	2012-07-17
Polyamic Acid, Polyimide, Photosensitive Resin Composition Comprising The Same, And Dry Film Manufactured From The Same App 20120012366 - LEE; Kwang-Joo ; et al.	2012-01-19
Polyamic Acid, Polyimide, Photosensitive Resin Composition Comprising The Same And Dry Film Manufactured By The Same App 20110200939 - LEE; Kwang-Joo ; et al.	2011-08-18
Alkali Developable Photosensitive Resin Composition And Dry Film Manufactured By The Same App 20100113640 - Lee; Kwang-Joo ; et al.	2010-05-06
Copper Clad Laminate for Chip on Film App 20090139753 - Kim; Byung-Nam ; et al.	2009-06-04
Metallic Laminate and Method for Preparing the Same App 20090101393 - Kim; Byung-Nam ; et al.	2009-04-23

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