Shim; Jae Beum

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shim; Jae Beum.The latest application filed is for "a semiconductor package having an etched groove for an embedded device formed on bottom surface of a support substrate and a method for fabricating the same".

Company Profile

0.4.5

Shim; Jae Beum - Incheon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package using a contact in a pleated sidewall encapsulant opening Grant 9,871,011 - Kim , et al. January 16, 2	2018-01-16
Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening Grant 9,716,071 - Ryu , et al. July 25, 2	2017-07-25
Semiconductor device and manufacturing method thereof Grant 9,704,747 - Ryu , et al. July 11, 2	2017-07-11
A Semiconductor Package Having An Etched Groove For An Embedded Device Formed On Bottom Surface Of A Support Substrate And A Method For Fabricating The Same App 20170194239 - Ryu; Ji Yeon ; et al.	2017-07-06
Semiconductor device and manufacturing method thereof Grant 9,653,336 - Han , et al. May 16, 2	2017-05-16
Semiconductor Device And Manufacturing Method Thereof App 20160276178 - Han; Yi Seul ; et al.	2016-09-22
Semiconductor Package Using A Contact In A Pleated Sidewall Encapsulant Opening App 20160233187 - Kim; Jae Yun ; et al.	2016-08-11
Semiconductor Device With Fine Pitch Redistribution Layers App 20160027747 - Ryu; Ji Yeon ; et al.	2016-01-28
Semiconductor Device And Manufacturing Method Thereof App 20140291844 - Ryu; Ji Yeon ; et al.	2014-10-02

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