Shim; Hee Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shim; Hee Yong.The latest application filed is for "thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same".

Company Profile

10.8.13

Shim; Hee Yong - Daejeon KR
SHIM; Hee Yong - B chcml KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermosetting resin composition for coating metal thin film and metal laminate using the same Grant 11,274,218 - Yun , et al. March 15, 2	2022-03-15
Resin composition for semiconductor package, prepreg and metal clad laminate using the same Grant 11,214,677 - Shim , et al. January 4, 2	2022-01-04
Thermosetting resin composition for semiconductor package and prepreg using the same Grant 11,193,015 - Moon , et al. December 7, 2	2021-12-07
Resin composition for semiconductor package, prepreg, and metal clad laminate using the same Grant 11,091,630 - Shim , et al. August 17, 2	2021-08-17
Thermosetting Resin Composition For Semiconductor Package, Prepreg And Metal Clad Laminate Using The Same App 20210171768 - SHIM; Changbo ; et al.	2021-06-10
Thermosetting Resin Composition For Coating Metal Thin Film And Metal Laminate Using The Same App 20210114348 - YUN; Minhyuk ; et al.	2021-04-22
Resin composition for semiconductor package, and prepreg and metal clad laminate using the same Grant 10,913,849 - Shim , et al. February 9, 2	2021-02-09
Thermosetting Resin Composite And Metal Clad Laminate Using The Same App 20200339740 - Shim; Changbo ; et al.	2020-10-29
Thermosetting Resin Composition For Semiconductor Package, Prepreg And Metal Clad Laminate Using The Same App 20200332056 - SHIM; Changbo ; et al.	2020-10-22
Resin Composition For Semiconductor Package, And Prepreg And Metal Clad Laminate Using The Same App 20200231804 - SHIM; Chang Bo ; et al.	2020-07-23
Thermosetting Resin Composition For Semiconductor Package And Prepreg Using The Same App 20200190313 - MOON; Hwayeon ; et al.	2020-06-18
Thermosetting Resin Composition For Coating Metal Thin Film And Metal Laminate Using The Same App 20200048440 - YUN; Minhyuk ; et al.	2020-02-13
Resin Composition For Semiconductor Package, Prepreg And Metal Clad Laminate Using The Same App 20190276661 - SHIM; Chang Bo ; et al.	2019-09-12
Resin Composition For Semiconductor Package, Prepreg, And Metal Clad Laminate Using The Same App 20190270881 - SHIM; Chang Bo ; et al.	2019-09-05
Thermosetting resin composition for semiconductor package and prepreg using the same Grant 10,294,341 - Moon , et al.	2019-05-21
Thermosetting resin composition for semiconductor package and prepreg using the same App 20180148555 - MOON; Hwa Yeon ; et al.	2018-05-31
Thermosetting Resin Composition For Semiconductor Package And Prepreg And Metal Clad Laminate Using The Same App 20160369099 - MOON; Hwa Yeon ; et al.	2016-12-22
Thermosetting resin composition and prepreg and metal clad laminate using the same Grant 9,278,505 - Shim , et al. March 8, 2	2016-03-08
Thermosetting Resin Composition And Prepreg And Metal Clad Laminate Using The Same App 20130319609 - Shim; Hee-Yong ; et al.	2013-12-05

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