Shikano; Taketoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shikano; Taketoshi.The latest application filed is for "power semiconductor device and manufacturing method thereof".

Company Profile

4.21.22

Shikano; Taketoshi - Tokyo JP
SHIKANO; Taketoshi - Chiyoda-ku Tokyo
Shikano; Taketoshi - Fukuoka JP
Shikano, Taketoshi - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing semiconductor device Grant 11,387,173 - Sakamoto , et al. July 12, 2	2022-07-12
Power semiconductor apparatus and manufacturing method therefor Grant 11,107,746 - Kawashima , et al. August 31, 2	2021-08-31
Power Semiconductor Device And Manufacturing Method Thereof App 20200303295 - ICHIKAWA; Keitaro ; et al.	2020-09-24
Method For Manufacturing Semiconductor Device App 20200091047 - SAKAMOTO; Ken ; et al.	2020-03-19
Lead frame and method for manufacturing semiconductor device Grant 10,541,193 - Sakamoto , et al. Ja	2020-01-21
Power Semiconductor Apparatus And Manufacturing Method Therefor App 20190057928 - KAWASHIMA; Hiroshi ; et al.	2019-02-21
Semiconductor device and method for manufacturing the same Grant 10,104,775 - Yoshimatsu , et al. October 16, 2	2018-10-16
Power semiconductor device and method for manufacturing the same Grant 9,947,613 - Kawashima , et al. April 17, 2	2018-04-17
Power Semiconductor Device And Method For Manufacturing The Same App 20170294369 - KAWASHIMA; Hiroshi ; et al.	2017-10-12
Power semiconductor device and method of manufacturing the same Grant 9,716,072 - Kawashima , et al. July 25, 2	2017-07-25
Semiconductor device and method for manufacturing the same Grant 9,691,730 - Yoshimatsu , et al. June 27, 2	2017-06-27
Lead Frame And Method For Manufacturing Semiconductor Device App 20170148709 - SAKAMOTO; Ken ; et al.	2017-05-25
Power semiconductor device Grant 9,627,302 - Ichikawa , et al. April 18, 2	2017-04-18
Power Semiconductor Device And Method Of Manufacturing The Same App 20160343644 - KAWASHIMA; Hiroshi ; et al.	2016-11-24
Semiconductor device and method of manufacturing semiconductor device Grant 9,466,548 - Sakamoto , et al. October 11, 2	2016-10-11
Method for manufacturing semiconductor device Grant 9,437,460 - Yoshimatsu , et al. September 6, 2	2016-09-06
Power Semiconductor Device App 20160233151 - ICHIKAWA; Keitaro ; et al.	2016-08-11
Semiconductor Device And Method For Manufacturing The Same App 20160099224 - YOSHIMATSU; Naoki ; et al.	2016-04-07
Method For Manufacturing Semiconductor Device App 20150380274 - YOSHIMATSU; Naoki ; et al.	2015-12-31
Semiconductor device Grant 9,171,772 - Shikano October 27, 2	2015-10-27
Semiconductor Device And Method For Manufacturing The Same App 20150092379 - YOSHIMATSU; Naoki ; et al.	2015-04-02
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20140353814 - Sakamoto; Ken ; et al.	2014-12-04
Semiconductor Device App 20140054751 - SHIKANO; Taketoshi	2014-02-27
Method for manufacturing semiconductor device including removing a resin burr Grant 8,518,751 - Sakamoto , et al. August 27, 2	2013-08-27
Method of manufacturing semiconductor device Grant 8,334,176 - Sakamoto , et al. December 18, 2	2012-12-18
Method For Manufacturing Semiconductor Device App 20120196405 - Sakamoto; Ken ; et al.	2012-08-02
Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion Grant 8,183,094 - Shikano May 22, 2	2012-05-22
Method Of Manufacturing Semiconductor Device App 20120088337 - SAKAMOTO; Ken ; et al.	2012-04-12
Method Of Manufacturing A Semiconductor Device Having A Semiconductor Chip And Resin Sealing Portion App 20110033986 - SHIKANO; TAKETOSHI	2011-02-10
Semiconductor device having a semiconductor chip and resin sealing portion Grant 7,855,464 - Shikano December 21, 2	2010-12-21
Semiconductor Device And Method Of Manufacturing The Same App 20100007026 - SHIKANO; Taketoshi	2010-01-14
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer Grant 7,151,311 - Nakajima , et al. December 19, 2	2006-12-19
Resin-molded device and manufacturing apparatus thereof Grant 6,791,167 - Hayashi , et al. September 14, 2	2004-09-14
Resin-sealed semiconductor device Grant 6,753,596 - Nakajima , et al. June 22, 2	2004-06-22
Resin-sealed Semiconductor Device App 20040108602 - Nakajima, Dai ; et al.	2004-06-10
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer App 20040089928 - Nakajima, Dai ; et al.	2004-05-13
Resin-molded device and manufacturing apparatus thereof App 20030183907 - Hayashi, Kenichi ; et al.	2003-10-02
Base interconnection substrate, manufacturing method thereof, semiconductor device and manfacturing method thereof App 20020149121 - Shikano, Taketoshi ; et al.	2002-10-17

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