SHIIBA; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIIBA; Koichi.The latest application filed is for "additive manufacturing device".

Company Profile

2.2.9

SHIIBA; Koichi - Nisshin-shi JP
Shiiba; Koichi - Nisshin JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Additive Manufacturing Device App 20220023950 - NAGAHAMA; Takaya ; et al.	2022-01-27
Additive Manufacturing Device App 20210379668 - Mizoguchi; Takashi ; et al.	2021-12-09
Additive Manufacturing Device App 20210213565 - TANO; Makoto ; et al.	2021-07-15
Bonding method and bonding device for metal member Grant 10,722,979 - Imoto , et al.	2020-07-28
Welding Apparatus And Method Of Manufacturing Welded Body App 20200075531 - IMOTO; Yoshinori ; et al.	2020-03-05
Shaping Method Using Additively Shaping Device And Additively Shaping Device App 20190275614 - IMOTO; Yoshinori ; et al.	2019-09-12
Additive Manufacturing Apparatus And Additive Manufacturing Method Of Shaped Article App 20190143407 - IMOTO; Yoshinori ; et al.	2019-05-16
Manufacturing Method And Manufacturing Apparatus For Additively Shaped Article App 20180311735 - Mitsui; Tetsuya ; et al.	2018-11-01
Method for heating a metal member, method for bonding heated metal members, and apparatus for heating a metal member Grant 9,960,144 - Nagahama , et al. May 1, 2	2018-05-01
Bonding Method And Bonding Device For Metal Member App 20170291259 - IMOTO; Yoshinori ; et al.	2017-10-12
Method For Heating A Metal Member, Method For Bonding Heated Metal Members, And Apparatus For Heating A Metal Member App 20170110435 - NAGAHAMA; Takaya ; et al.	2017-04-20

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