| Patent | Date |
|---|
Semiconductor Device Package And Method Of Manufacturing The Same
App 20220115339 - SHIH; Yu-Lin ; et al. | 2022-04-14 |
Semiconductor device package and method of manufacturing the same
Grant 11,232,993 - Shih , et al. January 25, 2 | 2022-01-25 |
Disposable Patient Isolation Hood
App 20220008274 - Shih; Yu-Lin ; et al. | 2022-01-13 |
Semiconductor device package and method of manufacturing the same
Grant 11,205,628 - Shih , et al. December 21, 2 | 2021-12-21 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210384148 - YU; Yuanhao ; et al. | 2021-12-09 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210202412 - SHIH; Yu-Lin ; et al. | 2021-07-01 |
Semiconductor device packages and method for manufacturing the same
Grant 11,031,274 - Shih , et al. June 8, 2 | 2021-06-08 |
Semiconductor Device Packages And Method For Manufacturing The Same
App 20210090931 - SHIH; Yu-Lin ; et al. | 2021-03-25 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200350223 - SHIH; Yu-Lin ; et al. | 2020-11-05 |
Substrate structure, semiconductor package including the same, and method for manufacturing the same
Grant 10,354,969 - Shih , et al. July 16, 2 | 2019-07-16 |
Semiconductor package structure having a heat dissipation structure
Grant 10,340,212 - Lee , et al. | 2019-07-02 |
Semiconductor device package having a multi-portion connection element
Grant 10,332,757 - Shih , et al. | 2019-06-25 |
Semiconductor Package Structure Having A Heat Dissipation Structure
App 20190164871 - LEE; Chih Cheng ; et al. | 2019-05-30 |
Semiconductor Device Package Having A Multi-portion Connection Element
App 20190164782 - SHIH; Yu-Lin ; et al. | 2019-05-30 |
Control module and multiple-antenna device having the same
Grant 10,270,184 - Lee , et al. | 2019-04-23 |
Control Module And Multiple-antenna Device Having The Same
App 20190089066 - LEE; Ming-Chia ; et al. | 2019-03-21 |
Substrate Sturcture, Semiconductor Package Including The Same, And Method For Manufacturing The Same
App 20190035753 - SHIH; Yu-Lin ; et al. | 2019-01-31 |
Integrated module having antenna
Grant 10,135,115 - Shih , et al. November 20, 2 | 2018-11-20 |
System of integrated module with antenna
Grant 10,084,228 - Chiu , et al. September 25, 2 | 2018-09-25 |
Semiconductor package including dielectric layers defining via holes extending to component pads
Grant 10,079,156 - Lee , et al. September 18, 2 | 2018-09-18 |
Integrated Module Having Antenna
App 20170309990 - SHIH; Yu-Lin ; et al. | 2017-10-26 |
System Of Integrated Module With Antenna
App 20170222299 - CHIU; Tsung-Wen ; et al. | 2017-08-03 |
Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof
Grant 9,721,799 - Shih , et al. August 1, 2 | 2017-08-01 |
Semiconductor Package With Embedded Component And Manufacturing Method Thereof
App 20160133537 - Shih; Yu-Lin ; et al. | 2016-05-12 |
Semiconductor Package Including Embedded Components And Method Of Making The Same
App 20160133562 - LEE; Chih-Cheng ; et al. | 2016-05-12 |
Interface Card Fastener
App 20050231924 - Shih, Yu-Lin | 2005-10-20 |
Interface card fastener
Grant 6,950,313 - Shih September 27, 2 | 2005-09-27 |
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