SHIH; Ying-jer
Patent Applications and Registrations
Patent applications and USPTO patent grants for SHIH; Ying-jer.The latest application filed is for "package method for electronic components by thin substrate".
- SHIH; Ying-jer - Hsinchu TW
| Patent | Date |
|---|---|
| Package Method For Electronic Components By Thin Substrate App 20140162382 - Guu; Yeong-yan ; et al. | 2014-06-12 |
| Package method for electronic components by thin substrate Grant 8,658,437 - Guu , et al. February 25, 2 | 2014-02-25 |
| Package method for electronic components by thin substrate Grant 8,501,502 - Guu , et al. August 6, 2 | 2013-08-06 |
| Package Method For Electronic Components By Thin Substrate App 20130171750 - Guu; Yeong-yan ; et al. | 2013-07-04 |
| Package Method For Electronic Components By Thin Substrate App 20130171749 - Guu; Yeong-yan ; et al. | 2013-07-04 |
| Package Method For Electronic Components By Thin Substrate App 20130171751 - Guu; Yoeong-yan ; et al. | 2013-07-04 |
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