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name:-0.004932165145874
name:-0.0041999816894531
name:-0.0017650127410889
Shih; Wen-Lin Patent Filings

Shih; Wen-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shih; Wen-Lin.The latest application filed is for "package structure".

Company Profile
1.4.4
  • Shih; Wen-Lin - Taipei TW
  • SHIH; Wen-Lin - Taipei City TW
  • Shih; Wen-Lin - Hsin-Chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device
Grant 11,456,256 - Tung , et al. September 27, 2
2022-09-27
Package Structure
App 20210375724 - SHAO; Tung-Liang ;   et al.
2021-12-02
Semiconductr Device, Stacked Semiconductor Device And Manufacturing Method Of Semiconductor Device
App 20210375766 - Tung; Chih-Hang ;   et al.
2021-12-02
Package structure and method for forming the same
Grant 11,101,195 - Shao , et al. August 24, 2
2021-08-24
Package Structure And Method For Forming The Same
App 20200091039 - SHAO; Tung-Liang ;   et al.
2020-03-19
Multi-strike process for bonding packages and the packages thereof
Grant 10,068,868 - Shao , et al. September 4, 2
2018-09-04
Multi-Strike Process for Bonding
App 20170194278 - Shao; Tung-Liang ;   et al.
2017-07-06
Multi-strike process for bonding
Grant 9,576,929 - Shao , et al. February 21, 2
2017-02-21

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