Shih; Wei-Yan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shih; Wei-Yan.The latest application filed is for "piezoelectric thin-film sensor and use thereof".
Company Profile
6.27.27
- Shih; Wei-Yan - Plano TX
Patent Activity
| Patent | Date |
|---|---|
| Differential sensor using thin-film piezoelectric capacitors Grant 11,393,971 - Khanna , et al. July 19, 2 | 2022-07-19 |
| Piezoelectric Thin-film Sensor And Use Thereof App 20220011177 - Shih; Wei-Yan | 2022-01-13 |
| Piezo-electric Sensor Reset App 20210389174 - Zwerg; Michael ; et al. | 2021-12-16 |
| Piezoelectric thin-film sensor and use thereof Grant 11,131,589 - Shih September 28, 2 | 2021-09-28 |
| Piezo-electric sensor reset Grant 11,105,676 - Zwerg , et al. August 31, 2 | 2021-08-31 |
| Piezoelectric sensing apparatus and method Grant 10,873,020 - Shih , et al. December 22, 2 | 2020-12-22 |
| Differential Sensor Using Thin-film Piezoelectric Capacitors App 20200168786 - Khanna; Sudhanshu ; et al. | 2020-05-28 |
| Integrated Force Sensing Element App 20190339806 - Shih; Wei-Yan ; et al. | 2019-11-07 |
| Integrated force sensing element Grant 10,353,503 - Shih , et al. July 16, 2 | 2019-07-16 |
| Piezo-electric Sensor Reset App 20190162590 - Zwerg; Michael ; et al. | 2019-05-30 |
| Piezoelectric Sensing Apparatus and Method App 20190051812 - Shih; Wei-Yan ; et al. | 2019-02-14 |
| Piezoelectric Thin-film Sensor And Use Thereof App 20180231423 - SHIH; Wei-Yan | 2018-08-16 |
| Piezoelectric thin-film sensor Grant 9,970,831 - Shih May 15, 2 | 2018-05-15 |
| Extended range ultrasound transducer Grant 9,751,108 - Shih , et al. September 5, 2 | 2017-09-05 |
| Wafer Level Packaging Of Mems App 20170217759 - Jacobsen; Stuart M. ; et al. | 2017-08-03 |
| Printed interconnects for semiconductor packages Grant 9,679,864 - Cook , et al. June 13, 2 | 2017-06-13 |
| Integrated Force Sensing Element App 20170123548 - Shih; Wei-Yan ; et al. | 2017-05-04 |
| Wafer level packaging of MEMS Grant 9,630,835 - Jacobsen , et al. April 25, 2 | 2017-04-25 |
| Printed Interconnects For Semiconductor Packages App 20170033072 - Cook; Benjamin Stassen ; et al. | 2017-02-02 |
| Extended Range Ultrasound Transducer App 20170028439 - Shih; Wei-Yan ; et al. | 2017-02-02 |
| Printed interconnects for semiconductor packages Grant 9,496,171 - Cook , et al. November 15, 2 | 2016-11-15 |
| Motion Sensing Power Switch App 20160329183 - Estevez; Leonardo ; et al. | 2016-11-10 |
| Low cost window production for hermetically sealed optical packages Grant 9,411,159 - Shih , et al. August 9, 2 | 2016-08-09 |
| Printed Interconnects For Semiconductor Packages App 20160093525 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
| Wafer Level Packaging Of Mems App 20160052781 - Jacobsen; Stuart M. ; et al. | 2016-02-25 |
| Piezoelectric Thin-film Sensor And Use Thereof App 20150226618 - SHIH; Wei-Yan | 2015-08-13 |
| Low Cost Window Production For Hermetically Sealed Optical Packages App 20150205098 - Shih; Wei-Yan ; et al. | 2015-07-23 |
| Low cost window production for hermetically sealed optical packages Grant 9,050,764 - Shih , et al. June 9, 2 | 2015-06-09 |
| Integrated system with computing and imaging capabilities Grant 8,674,933 - Shih , et al. March 18, 2 | 2014-03-18 |
| Silicon microphone transducer Grant 8,617,960 - Denison , et al. December 31, 2 | 2013-12-31 |
| Silicon microphone with integrated back side cavity Grant 8,536,666 - Shih September 17, 2 | 2013-09-17 |
| Silicon Microphone With Integrated Back Side Cavity App 20130064400 - Shih; Wei-Yan | 2013-03-14 |
| MEMS package having formed metal lid Grant 8,309,388 - Wachtler , et al. November 13, 2 | 2012-11-13 |
| Silicon microphone with integrated back side cavity Grant 8,304,846 - Shih November 6, 2 | 2012-11-06 |
| Low Cost Window Production For Hermetically Sealed Optical Packages App 20120036695 - Shih; Wei-Yan ; et al. | 2012-02-16 |
| Low cost window production for hermetically sealed optical packages Grant 8,042,248 - Shih , et al. October 25, 2 | 2011-10-25 |
| Silicon Microphone with Integrated Back Side Cavity App 20110156179 - Shih; Wei-Yan | 2011-06-30 |
| Silicon Microphone Transducer App 20110158439 - Denison; Marie ; et al. | 2011-06-30 |
| Microdisplay assemblies and methods of packaging microdisplays Grant 7,786,747 - Shih , et al. August 31, 2 | 2010-08-31 |
| MEMS Package Having Formed Metal Lid App 20090267223 - WACHTLER; Kurt P. ; et al. | 2009-10-29 |
| Microdisplay Assemblies and Methods of Packaging Microdisplays App 20090140757 - Shih; Wei-Yan ; et al. | 2009-06-04 |
| Integrated System With Computing And Imaging Capabilites App 20090128481 - Shih; Wei-Yan ; et al. | 2009-05-21 |
| Low cost window production for hermetically sealed optical packages App 20080080077 - Shih; Wei-Yan ; et al. | 2008-04-03 |
| Split beam micromirror Grant 7,106,491 - Meyer , et al. September 12, 2 | 2006-09-12 |
| Active border pixels for digital micromirror device Grant 6,937,382 - Shih August 30, 2 | 2005-08-30 |
| Active Border Pixels For Digital Micromirror Device App 20050146771 - Shih, Wei-Yan | 2005-07-07 |
| Split beam micromirror App 20030123126 - Meyer, Thomas J. ; et al. | 2003-07-03 |
| Aluminum nitride thin film formation on integrated circuits Grant 6,465,350 - Taylor , et al. October 15, 2 | 2002-10-15 |
| Method of growing surface aluminum nitride on aluminum films with low energy barrier App 20020009885 - Brankner, Keith J. ; et al. | 2002-01-24 |
| Bonding pads for integrated circuits having copper interconnect metallization Grant 6,329,722 - Shih , et al. December 11, 2 | 2001-12-11 |
| Wire bonded flip-chip assembly of semiconductor devices Grant 6,268,662 - Test , et al. July 31, 2 | 2001-07-31 |
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