Shih; Hui-Shen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shih; Hui-Shen.The latest application filed is for "interlayer dielectric layer with two tensile dielectric layers".

Company Profile

0.32.41

Shih; Hui-Shen - Changhua County TW
Shih; Hui-Shen - Chang-Hua Hsien N/A TW
Shih; Hui-Shen - Changhua Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interlayer dielectric layer with two tensile dielectric layers Grant 9,564,507 - Lin , et al. February 7, 2	2017-02-07
Interlayer Dielectric Layer With Two Tensile Dielectric Layers App 20160141383 - Lin; Yu-Cheng ; et al.	2016-05-19
Method for fabricating interlayer dielectric layer Grant 9,281,238 - Lin , et al. March 8, 2	2016-03-08
Method For Fabricating Interlayer Dielectric Layer App 20160013098 - Lin; Yu-Cheng ; et al.	2016-01-14
Stress Memorization Process And Semiconductor Structure Including Contact Etch Stop Layer App 20150228788 - Chen; Chun-Feng ; et al.	2015-08-13
Multifunction MEMS element and integrated method for making MOS and multifunction MEMS Grant 8,674,463 - Shih March 18, 2	2014-03-18
MEMS diaphragm Grant 8,492,857 - Shih , et al. July 23, 2	2013-07-23
Method for fabricating semiconductor device Grant 8,431,473 - Hu , et al. April 30, 2	2013-04-30
MEMS diaphragm Grant 8,390,085 - Shih , et al. March 5, 2	2013-03-05
Semiconductor Device And Method For Fabricating The Same App 20130009288 - Hu; Shu-Hui ; et al.	2013-01-10
Method of transferring a wafer Grant 8,142,258 - Yang , et al. March 27, 2	2012-03-27
MEMS diaphragm Grant 8,134,215 - Shih , et al. March 13, 2	2012-03-13
Integrated structure of MEMS device and CMOS image sensor device Grant 8,134,192 - Shih March 13, 2	2012-03-13
Fluid-confining Apparatus And Method Of Operating The Same App 20120043199 - Shih; Hui-Shen ; et al.	2012-02-23
Semiconductor device and method of fabricating the same Grant 8,101,987 - Shih January 24, 2	2012-01-24
Method of fabricating micro-electromechanical system microphone structure Grant 8,071,412 - Shih December 6, 2	2011-12-06
Micro-electromechanical system microphone structure Grant 8,072,036 - Shih December 6, 2	2011-12-06
Contact efuse structure Grant 8,035,191 - Lin , et al. October 11, 2	2011-10-11
Mems Diaphragm App 20110186945 - SHIH; HUI-SHEN ; et al.	2011-08-04
Mems Diaphragm App 20110169110 - SHIH; Hui-Shen ; et al.	2011-07-14
Fluid-confining apparatus Grant 7,967,960 - Shih , et al. June 28, 2	2011-06-28
Method of controlling statuses of wafers Grant 7,957,827 - Shih , et al. June 7, 2	2011-06-07
Method of transferring a wafer App 20110076129 - Yang; Kuo-Wei ; et al.	2011-03-31
Method of transferring a wafer Grant 7,909,677 - Yang , et al. March 22, 2	2011-03-22
Micro-electromechanical System Microphone Structure App 20110024851 - Shih; Hui-Shen	2011-02-03
Method Of Fabricating Micro-electromechanical System Microphone Structure App 20110027929 - Shih; Hui-Shen	2011-02-03
Integrated Structure Of Mems Device And Cmos Image Sensor Device App 20110006350 - Shih; Hui-Shen	2011-01-13
Method of fabricating micro-electromechanical system microphone structure Grant 7,851,247 - Shih December 14, 2	2010-12-14
Semiconductor Device And Method Of Fabricating The Same App 20100289066 - Shih; Hui-Shen	2010-11-18
Integrated structure of MEMS device and CMOS image sensor device and fabricating method thereof Grant 7,833,818 - Shih November 16, 2	2010-11-16
Method of supplying polishing liquid Grant 7,828,625 - Yu , et al. November 9, 2	2010-11-09
Multifunction Mens Element And Integrated Method For Making Mos And Multifunction Mens App 20100270628 - Shih; Hui-Shen	2010-10-28
Semiconductor device and method of fabricating the same Grant 7,795,056 - Shih September 14, 2	2010-09-14
Integrated Structure Of Mems Device And Cmos Image Sensor Device And Fabricating Method Thereof App 20100148283 - Shih; Hui-Shen	2010-06-17
Method To Integrate Micro Electro Mechanical System And Cmos Image Sensor App 20100144156 - Shih; Hui-Shen	2010-06-10
Method of cleaning reaction chamber, method of forming protection film and protection wafer Grant 7,732,009 - Mao , et al. June 8, 2	2010-06-08
CMP head Grant 7,731,572 - Yu , et al. June 8, 2	2010-06-08
Chemical mechanical polishing method with inspection pre and post processing Grant 7,732,332 - Shih June 8, 2	2010-06-08
Contact efuse structure, method of making a contact efuse device containing the same, and method of making a read only memory containing the same App 20100133649 - Lin; Yung-Chang ; et al.	2010-06-03
Mems Diaphragm App 20100090298 - Shih; Hui-Shen ; et al.	2010-04-15
Micro-electromechanical System Microphone Structure And Method Of Fabricating The Same App 20100065931 - Shih; Hui-Shen	2010-03-18
Method For The Protection Of Information In Multi-project Wafers App 20100068832 - Shih; Hui-Shen	2010-03-18
Reworked integrated circuit device and reworking method thereof Grant 7,662,645 - Shih February 16, 2	2010-02-16
Semiconductor Device And Method Of Fabricating The Same App 20090298216 - Shih; Hui-Shen	2009-12-03
Microelectromechanical System Microphone App 20090285419 - Shih; Hui-Shen ; et al.	2009-11-19
Fluid-confining Apparatus And Method Of Operating The Same App 20090200161 - Shih; Hui-Shen ; et al.	2009-08-13
Method of etching a dielectric layer to form a contact hole and a via hole and damascene method Grant 7,557,025 - Shih July 7, 2	2009-07-07
Method Of Controlling Statuses Of Wafers App 20090171495 - Shih; Hui-Shen ; et al.	2009-07-02
Method For Forming An Opening Of Nano-meter Scale App 20090123877 - Shih; Hui-Shen ; et al.	2009-05-14
Method For Forming Metal Film Or Stacked Layer Including Metal Film With Reduced Surface Roughness App 20090120785 - Shih; Hui-Shen ; et al.	2009-05-14
Expandable polishing platen device App 20090117835 - Shih; Hui-Shen	2009-05-07
Fluid-confining Apparatus And Method Of Operating The Same App 20090117740 - Shih; Hui-Shen ; et al.	2009-05-07
Method Of Cleaning Transparent Device In A Thermal Process Apparatus, Thermal Process Apparatus And Process Using The Same Thermal Process Apparatus App 20090107527 - Wang; Yu-Yung ; et al.	2009-04-30
Method Of Supplying Polishing Liquid App 20090111361 - Yu; Chi-Min ; et al.	2009-04-30
Method for manufacturing semiconductor device that includes baking a dielectric layer after exposure to plasma Grant 7,510,964 - Mao , et al. March 31, 2	2009-03-31
Reworked Integrated Circuit Device And Reworking Method Thereof App 20090065944 - Shih; Hui-Shen	2009-03-12
Method of preventing a peeling issue of a high stressed thin film Grant 7,482,244 - Mao , et al. January 27, 2	2009-01-27
Polishing Head And Edge Control Ring Thereof, And Method Of Increasing Polishing Rate At Wafer Edge App 20090023368 - Wu; Chang-Hsin ; et al.	2009-01-22
Method For Forming A Seamless Shallow Trench Isolation App 20080305609 - Shih; Hui-Shen	2008-12-11
Method of transferring a wafer App 20080287044 - Yang; Kuo-Wei ; et al.	2008-11-20
Method Of Cleaning Reaction Chamber, Method Of Forming Protection Film And Protection Wafer App 20080075852 - Mao; Chih-Jen ; et al.	2008-03-27
Chemical Mechanical Polishing Apparatus And Operating Method Thereof App 20070212881 - Shih; Hui-Shen	2007-09-13
Method For Manufacturing Semiconductor Device App 20070173065 - Mao; Chih-Jen ; et al.	2007-07-26
Method For Forming Metal Film Or Stacked Layer Including Metal Film With Reduced Surface Roughness App 20070144892 - Shih; Hui-Shen ; et al.	2007-06-28
Method Of Etching A Dielectric Layer To Form A Contact Hole And A Via Hole And Damascene Method App 20070105386 - Shih; Hui-Shen	2007-05-10
Method For Reducing Positive Charges Accumulated On Chips During Ion Implantation App 20070072356 - Shih; Hui-Shen ; et al.	2007-03-29
Method Of Preventing A Peeling Issue Of A High Stressed Thin Film App 20070066026 - Mao; Chih-Jen ; et al.	2007-03-22
Chemical mechanical polishing equipment and conditioning thereof Grant 7,008,302 - Wu , et al. March 7, 2	2006-03-07
Chemical mechanical polishing equipment and conditioning thereof App 20050250425 - Wu, Vinscent ; et al.	2005-11-10

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