Shih; Hsiangyin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shih; Hsiangyin.The latest application filed is for "method for improving polyimide non-adherence to substrate and polyimide solution".
- Shih; Hsiangyin - Shenzhen CN
- SHIH; Hsiangyin - Shenzhen City CN
- Shih; Hsiangyin - Guangdong CN
| Patent | Date |
|---|---|
| Device for prebaking alignment film by using temperature-controllable pin to support substrate and method thereof Grant 9,075,266 - Zhu , et al. July 7, 2 | 2015-07-07 |
| Method For Improving Polyimide Non-adherence To Substrate And Polyimide Solution App 20150112002 - ZHU; Meina ; et al. | 2015-04-23 |
| Component supporting device Grant 8,961,693 - Yan , et al. February 24, 2 | 2015-02-24 |
| Method For Improving Polyimide Non-adherence To Substrate App 20140004714 - ZHU; MEINA ; et al. | 2014-01-02 |
| Method for Improving Polyimide Non-Adherence to Substrate and Polyimide Solution App 20130281583 - Zhu; Meina ; et al. | 2013-10-24 |
| Device for Prebaking Alignment Film by Using Temperature-Controllable Pin to Support Substrate and Method Thereof App 20130279889 - Zhu; Meina ; et al. | 2013-10-24 |
| Component Supporting Device App 20120313308 - Yan; Maocheng ; et al. | 2012-12-13 |
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