SHIH; Didmin
Patent Applications and Registrations
Patent applications and USPTO patent grants for SHIH; Didmin.The latest application filed is for "switch chip with bond wires replacing traces in a die".
- SHIH; Didmin - New Taipei City TW
- Shih; Didmin - Milpitas CA
| Patent | Date |
|---|---|
| Switch Chip With Bond Wires Replacing Traces In A Die App 20220199612 - SHIH; Didmin ; et al. | 2022-06-23 |
| Compensation for gain imbalance, phase imbalance and DC offsets in a transmitter Grant 7,881,402 - Gao , et al. February 1, 2 | 2011-02-01 |
| Compensation for gain imbalance, phase imbalance and DC offsets in a transmitter App 20080063113 - Gao; Wei ; et al. | 2008-03-13 |
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