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Patent applications and USPTO patent grants for Shih; Chinnwen.The latest application filed is for "release height adjustment of stressy metal devices by annealing before and after release".
Patent | Date |
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Sub-resolution gaps generated by controlled over-etching Grant 7,129,181 - Liu , et al. October 31, 2 | 2006-10-31 |
Release height adjustment of stressy metal devices by annealing before and after release Grant 6,973,722 - Hantschel , et al. December 13, 2 | 2005-12-13 |
Integrated driver electronics for MEMS device using high voltage thin film transistors Grant 6,912,082 - Lu , et al. June 28, 2 | 2005-06-28 |
Release Height Adjustment Of Stressy Metal Devices By Annealing Before And After Release App 20050102833 - Hantschel, Thomas ;   et al. | 2005-05-19 |
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