| Patent | Date |
|---|
Semiconductor Device And Method Of Manufacturing The Same
App 20220293552 - Lo; Yi-Jen ; et al. | 2022-09-15 |
Semiconductor Device And Method Of Manufacturing The Same
App 20220293561 - Lo; Yi-Jen ; et al. | 2022-09-15 |
Integrated Circuit Device
App 20220285354 - SHIH; Chiang-Lin ; et al. | 2022-09-08 |
Integrated circuit device and manufacturing method thereof
Grant 11,374,009 - Shih , et al. June 28, 2 | 2022-06-28 |
Fuse array structure
Grant 11,322,216 - Kang , et al. May 3, 2 | 2022-05-03 |
Semiconductor structure with buried power line and buried signal line and method for manufacturing the same
Grant 11,315,928 - Shih , et al. April 26, 2 | 2022-04-26 |
Method For Fabricating Semiconductor Device With Protruding Contact
App 20220122982 - SHIH; CHIANG-LIN ; et al. | 2022-04-21 |
Semiconductor Device With Protruding Contact And Method For Fabricating The Same
App 20220122979 - SHIH; CHIANG-LIN ; et al. | 2022-04-21 |
Integrated Circuit Device And Manufacturing Method Thereof
App 20220122973 - SHIH; Chiang-Lin ; et al. | 2022-04-21 |
Method Of Manufacturing Semiconductor Device
App 20220102302 - SHIH; CHIANG-LIN ; et al. | 2022-03-31 |
Semiconductor structure and method of manufacturing thereof
Grant 11,289,492 - Shih , et al. March 29, 2 | 2022-03-29 |
Method Of Forming Semiconductor Structure
App 20220093462 - SHIH; Chiang-Lin ; et al. | 2022-03-24 |
Semiconductor Structure And Method Of Forming The Same
App 20220084884 - SHIH; Chiang-Lin ; et al. | 2022-03-17 |
Semiconductor Structure With Buried Power Line And Buried Signal Line And Method For Manufacturing The Same
App 20220077147 - SHIH; CHIANG-LIN ; et al. | 2022-03-10 |
Method For Manufacturing Semiconductor Structure With Buried Power Line And Buried Signal Line
App 20220077148 - SHIH; CHIANG-LIN ; et al. | 2022-03-10 |
Semiconductor device and method of manufacturing the same
Grant 11,270,962 - Shih , et al. March 8, 2 | 2022-03-08 |
Semiconductor structure and manufacturing method thereof
Grant 11,264,391 - Shih , et al. March 1, 2 | 2022-03-01 |
Semiconductor Structure And Method Of Manufacturing Thereof
App 20220059435 - SHIH; Chiang-Lin ; et al. | 2022-02-24 |
Method For Manufacturing Semiconductor Device
App 20220028760 - SHIH; CHIANG-LIN ; et al. | 2022-01-27 |
Die assembly and method of manufacturing the same
Grant 11,217,560 - Shih , et al. January 4, 2 | 2022-01-04 |
Semiconductor structure and method of manufacturing thereof
Grant 11,205,607 - Shih , et al. December 21, 2 | 2021-12-21 |
Semiconductor device and method for manufacturing the same
Grant 11,189,545 - Shih , et al. November 30, 2 | 2021-11-30 |
Semiconductor Structure And Method Of Manufacturing Thereof
App 20210217684 - SHIH; Chiang-Lin ; et al. | 2021-07-15 |
Die Assembly And Method Of Manufacturing The Same
App 20210125966 - SHIH; Chiang-Lin ; et al. | 2021-04-29 |
Semiconductor Device And Method Of Manufacturing The Same
App 20210125947 - SHIH; Chiang-Lin ; et al. | 2021-04-29 |
Semiconductor device with stacked die device
Grant 10,910,345 - Shih , et al. February 2, 2 | 2021-02-02 |
Semiconductor Device And Method For Manufacturing The Same
App 20200402891 - SHIH; CHIANG-LIN ; et al. | 2020-12-24 |
Anti-fuse structure
Grant 10,854,545 - Huang , et al. December 1, 2 | 2020-12-01 |
Method Of Manufacturing Semiconductor Device
App 20200357765 - WU; PEI-JHEN ; et al. | 2020-11-12 |
Semiconductor Device And Method Of Manufacturing The Same
App 20200350284 - SHIH; CHIANG-LIN ; et al. | 2020-11-05 |
Method of manufacturing semiconductor device
Grant 10,811,382 - Wu , et al. October 20, 2 | 2020-10-20 |
Bonding pad, semiconductor structure, and method of manufacturing semiconductor structure
Grant 10,734,338 - Wu , et al. | 2020-08-04 |
Bonding Pad, Semiconductor Structure, And Method Of Manufacturing Semiconductor Structure
App 20200168573 - WU; Pei-Jhen ; et al. | 2020-05-28 |
Antifuse Structure
App 20200020705 - HUANG; CHIN-LING ; et al. | 2020-01-16 |
Antifuse structure
Grant 10,522,556 - Huang , et al. Dec | 2019-12-31 |
Method for preparing a semiconductor pattern having semiconductor structure of different lengths
Grant 10,332,749 - Shih , et al. | 2019-06-25 |
Method of forming fine interconnection for semiconductor devices
Grant 10,262,862 - Shih , et al. | 2019-04-16 |
Method For Preparing A Semiconductor Pattern Having Semiconductor Structure Of Different Lengths
App 20190080920 - SHIH; Chiang-Lin ; et al. | 2019-03-14 |
Method Of Forming Fine Island Patterns Of Semiconductor Devices
App 20190074182 - SHIH; Chiang-Lin ; et al. | 2019-03-07 |
Method of forming fine island patterns of semiconductor devices
Grant 10,204,783 - Shih , et al. Feb | 2019-02-12 |
Semiconductor Structure And Method For Preparing The Same
App 20190027364 - LIN; JENG-PING ; et al. | 2019-01-24 |
Semiconductor pattern having semiconductor structures of different lengths
Grant 10,170,328 - Shih , et al. J | 2019-01-01 |
Method of forming fine island patterns of semiconductor devices
Grant 10,115,594 - Shih , et al. October 30, 2 | 2018-10-30 |
Method for preparing a semiconductor structure having second line patterns and third line patterns formed over first line patterns
Grant 10,090,154 - Lin , et al. October 2, 2 | 2018-10-02 |
Method For Forming A Pattern
App 20160379836 - Shih; Chiang-Lin ; et al. | 2016-12-29 |
Method for forming a pattern
Grant 9,530,663 - Shih , et al. December 27, 2 | 2016-12-27 |
Lithography resolution improving method
Grant 8,658,051 - Cho , et al. February 25, 2 | 2014-02-25 |
Dynamic Wafer Alignment Method In Exposure Scanner System
App 20120140193 - Chiu; Chui-Fu ; et al. | 2012-06-07 |
Exposure method
Grant 7,998,660 - Shih , et al. August 16, 2 | 2011-08-16 |
Method of forming a trench capacitor
Grant 7,915,133 - Cho , et al. March 29, 2 | 2011-03-29 |
Exposure method
Grant 7,892,712 - Shih , et al. February 22, 2 | 2011-02-22 |
Apparatus For Reducing Cost Of Developer And The Method Thereof
App 20100227069 - Shih; Chiang-Lin ; et al. | 2010-09-09 |
Overlay alignment mark and alignment method for the fabrication of trench-capacitor dram devices
Grant 7,723,181 - Liu , et al. May 25, 2 | 2010-05-25 |
Scanning Exposure Method
App 20100097596 - Shih; Chiang-Lin ; et al. | 2010-04-22 |
Exposure Method
App 20100009294 - Shih; Chiang-Lin ; et al. | 2010-01-14 |
Exposure Method
App 20090290134 - Shih; Chiang-Lin ; et al. | 2009-11-26 |
Lithography Resolution Improving Method
App 20090233448 - CHO; Kuo-Yao ; et al. | 2009-09-17 |
Exposure Method
App 20090111060 - Shih; Chiang-Lin ; et al. | 2009-04-30 |
Method Of Forming A Trench Capacitor
App 20080286934 - CHO; Kuo-Yao ; et al. | 2008-11-20 |
Metal Interconnect Structure
App 20080251933 - Cho; Kuo-Yao ; et al. | 2008-10-16 |
Alignment mark and alignment method for the fabrication of trench-capacitor dram devices
Grant 7,419,882 - Wu , et al. September 2, 2 | 2008-09-02 |
Overlay Alignment Mark And Alignment Method For The Fabrication Of Trench-capacitor Dram Devices
App 20070190736 - Liu; An-Hsiung ; et al. | 2007-08-16 |
Method of forming three-dimensional lithographic pattern
App 20070178410 - Shih; Chiang-Lin ; et al. | 2007-08-02 |
Alignment Mark And Alignment Method For The Fabrication Of Trench-capacitor Dram Devices
App 20060234440 - WU; Yuan-Hsun ; et al. | 2006-10-19 |
Conducting wire and contact opening forming method for reducing photoresist thickness and via resistance
Grant 6,979,638 - Huang , et al. December 27, 2 | 2005-12-27 |
Conducting Wire And Contact Opening Forming Method For Reducing Photoresist Thickness And Via Resistance
App 20050186775 - Huang, Tse-Yao ; et al. | 2005-08-25 |
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