| Patent | Date |
|---|
Wafer on Wafer Bonding Structure
App 20220278074 - Chen; Ming-Fa ; et al. | 2022-09-01 |
Three-dimensional stacking structure and manufacturing method thereof
Grant 11,417,629 - Chen , et al. August 16, 2 | 2022-08-16 |
Package Structure And Method Of Fabricating The Same
App 20220189918 - Chen; Ming-Fa ; et al. | 2022-06-16 |
Die Stack Structure, Semiconductor Structure And Method Of Fabricating The Same
App 20220181301 - Chen; Ming-Fa ; et al. | 2022-06-09 |
Package structure and manufacturing method thereof
Grant 11,335,655 - Wan , et al. May 17, 2 | 2022-05-17 |
Package Structure And Method Of Manufacturing The Same
App 20220139882 - Chen; Ming-Fa ; et al. | 2022-05-05 |
Package structure and method of fabricating the same
Grant 11,322,477 - Chen , et al. May 3, 2 | 2022-05-03 |
Integrated fan-out package and manufacturing method thereof
Grant 11,282,810 - Wan , et al. March 22, 2 | 2022-03-22 |
Semiconductor structure and method of fabricating the same
Grant 11,264,362 - Chen , et al. March 1, 2 | 2022-03-01 |
Package structure, electronic device and method of fabricating package structure
Grant 11,245,176 - Hsiao , et al. February 8, 2 | 2022-02-08 |
Package structure and manufacturing method thereof
Grant 11,244,896 - Hsiao , et al. February 8, 2 | 2022-02-08 |
Package structure and method of manufacturing the same
Grant 11,233,035 - Chen , et al. January 25, 2 | 2022-01-25 |
Multi-Liner TSV Structure and Method Forming Same
App 20220020675 - Chen; Ming-Fa ; et al. | 2022-01-20 |
Package Structures And Methods Of Fabricating The Same
App 20210391322 - Chen; Ming-Fa ; et al. | 2021-12-16 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20210384164 - Chen; Ming-Fa ; et al. | 2021-12-09 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210375826 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Package Structure And Method Of Manufacturing The Same
App 20210375827 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Semiconductor structure and manufacturing method thereof
Grant 11,177,355 - Yu , et al. November 16, 2 | 2021-11-16 |
Semiconductor structure and method manufacturing the same
Grant 11,164,848 - Chen , et al. November 2, 2 | 2021-11-02 |
Manufacturing Method Of Semiconductor Structure
App 20210327807 - Chen; Ming-Fa ; et al. | 2021-10-21 |
Package Structure
App 20210313671 - Chuang; Nan-Chin ; et al. | 2021-10-07 |
Semiconductor Device And Method
App 20210305094 - Chen; Ming-Fa ; et al. | 2021-09-30 |
Package
App 20210305214 - Chen; Ming-Fa ; et al. | 2021-09-30 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210296288 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Semiconductor Packages
App 20210296251 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Integrated Circuit Package and Method
App 20210288030 - Chen; Ming-Fa ; et al. | 2021-09-16 |
Stacking structure, package structure and method of fabricating the same
Grant 11,114,413 - Chen , et al. September 7, 2 | 2021-09-07 |
Chip Package With Antenna Element
App 20210265289 - CHIANG; Yung-Ping ; et al. | 2021-08-26 |
Semiconductor Packages And Manufacturing Mehtods Thereof
App 20210257717 - Chiang; Yung-Ping ; et al. | 2021-08-19 |
Three-dimensional Stacking Structure And Manufacturing Method Thereof
App 20210249380 - Chen; Ming-Fa ; et al. | 2021-08-12 |
Integrated Devices in Semiconductor Packages and Methods of Forming Same
App 20210225786 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor structure and manufacturing method thereof
Grant 11,069,608 - Chen , et al. July 20, 2 | 2021-07-20 |
Package and manufacturing method of reconstructed wafer
Grant 11,063,022 - Chen , et al. July 13, 2 | 2021-07-13 |
Package structure, chip structure and method of fabricating the same
Grant 11,063,019 - Chen , et al. July 13, 2 | 2021-07-13 |
Semiconductor packages and method of forming the same
Grant 11,056,438 - Chen , et al. July 6, 2 | 2021-07-06 |
Package structure
Grant 11,043,731 - Chuang , et al. June 22, 2 | 2021-06-22 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20210183760 - Shih; Chao-Wen ; et al. | 2021-06-17 |
Integrated circuit package and method
Grant 11,024,605 - Chen , et al. June 1, 2 | 2021-06-01 |
Chip package with antenna element
Grant 11,004,809 - Chiang , et al. May 11, 2 | 2021-05-11 |
Semiconductor package structure
Grant 11,004,810 - Wu , et al. May 11, 2 | 2021-05-11 |
Semiconductor Structures and Methods of Forming the Same
App 20210134730 - Yu; Chen-Hua ; et al. | 2021-05-06 |
Semiconductor device and method of manufacturing semiconductor device
Grant 10,991,649 - Yu , et al. April 27, 2 | 2021-04-27 |
Semiconductor packages and manufacturing methods thereof
Grant 10,978,782 - Chiang , et al. April 13, 2 | 2021-04-13 |
Integrated devices in semiconductor packages and methods of forming same
Grant 10,971,460 - Yu , et al. April 6, 2 | 2021-04-06 |
Package Structure And Manufacturing Method Thereof
App 20210098396 - Wan; Albert ; et al. | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210098420 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Package And Manufacturing Method Of Reconstructed Wafer
App 20210082874 - Chen; Ming-Fa ; et al. | 2021-03-18 |
Package structure and method of fabricating the same
Grant 10,937,719 - Chiang , et al. March 2, 2 | 2021-03-02 |
Conductive traces in semiconductor devices and methods of forming same
Grant 10,937,734 - Shih , et al. March 2, 2 | 2021-03-02 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210057332 - Chen; Ming-Fa ; et al. | 2021-02-25 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210020602 - Chen; Ming-Fa ; et al. | 2021-01-21 |
Package And Manufacturing Method Thereof
App 20200411473 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Semiconductor Packages And Method Of Forming The Same
App 20200411445 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20200411476 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Package structure and method of fabricating package structure
Grant 10,879,197 - Wan , et al. December 29, 2 | 2020-12-29 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402942 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402960 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Semiconductor device and manufacturing method thereof
Grant 10,872,842 - Wan , et al. December 22, 2 | 2020-12-22 |
Package structure and manufacturing method thereof
Grant 10,867,940 - Wan , et al. December 15, 2 | 2020-12-15 |
Semiconductor structures and methods of forming the same
Grant 10,867,929 - Yu , et al. December 15, 2 | 2020-12-15 |
Package structure, package-on-package structure and method of fabricating the same
Grant 10,867,966 - Chen , et al. December 15, 2 | 2020-12-15 |
Semiconductor package, semiconductor device and method for packaging semiconductor device
Grant 10,867,882 - Wan , et al. December 15, 2 | 2020-12-15 |
Integrated Circuit Package and Method
App 20200381396 - Chen; Ming-Fa ; et al. | 2020-12-03 |
Package Structure, Package-on-package Structure And Method Of Fabricating The Same
App 20200343223 - Chen; Hsien-Wei ; et al. | 2020-10-29 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20200335477 - Wan; Albert ; et al. | 2020-10-22 |
Semiconductor Device Having Antenna And Manufacturing Method Thereof
App 20200335459 - Wan; Albert ; et al. | 2020-10-22 |
Semiconductor Device And Manufacturing Method Thereof
App 20200273773 - Wan; Albert ; et al. | 2020-08-27 |
Method of manufacturing integrated fan-out package
Grant 10,756,052 - Wan , et al. A | 2020-08-25 |
Semiconductor Packages And Manufacturing Mehtods Thereof
App 20200258799 - A1 | 2020-08-13 |
Semiconductor device having antenna and manufacturing method thereof
Grant 10,741,508 - Wan , et al. A | 2020-08-11 |
Package Structure And Manufacturing Method Thereof
App 20200243441 - Hsiao; Min-Chien ; et al. | 2020-07-30 |
Semiconductor device and manufacturing method thereof
Grant 10,720,495 - Yu , et al. | 2020-07-21 |
Semiconductor Structures And Methods Of Forming The Same
App 20200185330 - Yu; Chen-Hua ; et al. | 2020-06-11 |
Package Structure, Electronic Device And Method Of Fabricating Package Structure
App 20200153083 - Hsiao; Min-Chien ; et al. | 2020-05-14 |
Semiconductor packages and manufacturing methods thereof
Grant 10,636,713 - Chiang , et al. | 2020-04-28 |
Semiconductor Package Structure
App 20200118952 - Wu; Kai-Chiang ; et al. | 2020-04-16 |
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20200118916 - YU; TSUNG-YUAN ; et al. | 2020-04-16 |
Semiconductor Package, Semiconductor Device And Method For Packaging Semiconductor Device
App 20200091031 - Wan; Albert ; et al. | 2020-03-19 |
Package Structure
App 20200067173 - Chuang; Nan-Chin ; et al. | 2020-02-27 |
Package Structure And Manufacturing Method Thereof
App 20200058607 - Wan; Albert ; et al. | 2020-02-20 |
Package structure, electronic device and method of fabricating package structure
Grant 10,535,913 - Hsiao , et al. Ja | 2020-01-14 |
Method of manufacturing semiconductor device
Grant 10,510,652 - Yu , et al. Dec | 2019-12-17 |
Semiconductor package structure
Grant 10,510,693 - Wu , et al. Dec | 2019-12-17 |
Packaging of semiconductor device with antenna and heat spreader
Grant 10,490,479 - Wan , et al. Nov | 2019-11-26 |
Method Of Manufacturing Integrated Fan-out Package
App 20190355694 - Wan; Albert ; et al. | 2019-11-21 |
Package structure
Grant 10,483,617 - Chuang , et al. Nov | 2019-11-19 |
Package structure and manufacturing method thereof
Grant 10,475,757 - Wan , et al. Nov | 2019-11-12 |
Integrated Devices in Semiconductor Packages and Methods of Forming Same
App 20190341363 - Yu; Chen-Hua ; et al. | 2019-11-07 |
Semiconductor Device And Manufacturing Method Thereof
App 20190333877 - Wan; Albert ; et al. | 2019-10-31 |
Chip Package With Antenna Element
App 20190279951 - CHIANG; Yung-Ping ; et al. | 2019-09-12 |
Package Structure, Electronic Device And Method Of Fabricating Package Structure
App 20190252762 - Hsiao; Min-Chien ; et al. | 2019-08-15 |
Package structure having connecting module
Grant 10,381,309 - Wang , et al. A | 2019-08-13 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190237553 - YU; CHEN-HUA ; et al. | 2019-08-01 |
Method of manufacturing integrated fan-out package
Grant 10,366,966 - Wan , et al. July 30, 2 | 2019-07-30 |
Integrated devices in semiconductor packages and methods of forming same
Grant 10,354,964 - Yu , et al. July 16, 2 | 2019-07-16 |
Automatic medicine retrieving device
Grant 10,327,995 - Wang , et al. | 2019-06-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,319,692 - Chiang , et al. | 2019-06-11 |
Structure and formation method of chip package with antenna element
Grant 10,312,203 - Chiang , et al. | 2019-06-04 |
Manufacturing method of semiconductor package
Grant 10,312,209 - Shih , et al. | 2019-06-04 |
Package Structures
App 20190157206 - Wang; Chuei-Tang ; et al. | 2019-05-23 |
Package Structure And Manufacturing Method Thereof
App 20190157224 - Wan; Albert ; et al. | 2019-05-23 |
Package structure, electronic device and method of fabricating package structure
Grant 10,276,920 - Hsiao , et al. | 2019-04-30 |
Semiconductor structure and manufacturing method thereof
Grant 10,269,904 - Yu , et al. | 2019-04-23 |
Semiconductor Packages And Manufacturing Mehtods Thereof
App 20190115271 - Chiang; Yung-Ping ; et al. | 2019-04-18 |
Package Structure
App 20190103652 - Chuang; Nan-Chin ; et al. | 2019-04-04 |
Package Structure, Electronic Device And Method Of Fabricating Package Structure
App 20190097304 - Hsiao; Min-Chien ; et al. | 2019-03-28 |
Semiconductor Package Structure
App 20190096828 - Wu; Kai-Chiang ; et al. | 2019-03-28 |
Package Structure And Method Of Fabricating Package Structure
App 20190067220 - Wan; Albert ; et al. | 2019-02-28 |
Package Structure And Manufacturing Method Thereof
App 20190027449 - Wan; Albert ; et al. | 2019-01-24 |
Semiconductor structure and method of manufacturing the same
Grant 10,183,858 - Wan , et al. Ja | 2019-01-22 |
Package structure and manufacturing method thereof
Grant 10,186,492 - Wan , et al. Ja | 2019-01-22 |
Sensor packages and manufacturing mehtods thereof
Grant 10,157,807 - Chiang , et al. Dec | 2018-12-18 |
Package Structure And Method Of Fabricating The Same
App 20180269139 - Chiang; Yung-Ping ; et al. | 2018-09-20 |
Integrated Devices in Semiconductor Packages and Methods of Forming Same
App 20180247905 - Yu; Chen-Hua ; et al. | 2018-08-30 |
Manufacturing Method Of Semiconductor Package
App 20180233472 - SHIH; CHAO-WEN ; et al. | 2018-08-16 |
Structure And Formation Method Of Chip Package With Antenna Element
App 20180166405 - CHIANG; Yung-Ping ; et al. | 2018-06-14 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20180148317 - WAN; ALBERT ; et al. | 2018-05-31 |
Semiconductor packaging and manufacturing method thereof
Grant 9,953,942 - Shih , et al. April 24, 2 | 2018-04-24 |
Automatic Medicine Retrieving Device
App 20180104153 - WANG; YU-TING ; et al. | 2018-04-19 |
Method Of Manufacturing Semiconductor Device
App 20180047664 - YU; TSUNG-YUAN ; et al. | 2018-02-15 |
Sensor Packages And Manufacturing Mehtods Thereof
App 20170345731 - Chiang; Yung-Ping ; et al. | 2017-11-30 |
Conductive Traces In Semiconductor Devices And Methods Of Forming Same
App 20170250130 - Shih; Chao-Wen ; et al. | 2017-08-31 |
Method of manufacturing a semiconductor device having scribe lines
Grant 9,728,477 - Wu , et al. August 8, 2 | 2017-08-08 |
Semiconductor structure and manufacturing method thereof
Grant 9,653,341 - Miao , et al. May 16, 2 | 2017-05-16 |
Conductive traces in semiconductor devices and methods of forming same
Grant 9,653,406 - Shih , et al. May 16, 2 | 2017-05-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170103955 - CHIANG; YUNG-PING ; et al. | 2017-04-13 |
Semiconductor device and manufacturing method thereof
Grant 9,589,915 - Yu , et al. March 7, 2 | 2017-03-07 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20170062369 - SHIH; CHAO-WEN ; et al. | 2017-03-02 |
Semiconductor packaging and manufacturing method thereof
Grant 9,543,263 - Shih , et al. January 10, 2 | 2017-01-10 |
Semiconductor structure with oval shaped conductor
Grant 9,543,259 - Chiang , et al. January 10, 2 | 2017-01-10 |
3D package with through substrate vias
Grant 9,530,759 - Yu , et al. December 27, 2 | 2016-12-27 |
Semiconductor device
Grant 9,484,308 - Liu , et al. November 1, 2 | 2016-11-01 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20160307852 - Shih; Chao-Wen ; et al. | 2016-10-20 |
Semiconductor device and manufacturing method thereof
Grant 9,437,490 - Yu , et al. September 6, 2 | 2016-09-06 |
Semiconductor structure and manufacturing method thereof
Grant 9,431,360 - Kuo , et al. August 30, 2 | 2016-08-30 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160240453 - WU; NIEN-FANG ; et al. | 2016-08-18 |
3D Package With Through Substrate Vias
App 20160218090 - Yu; Chen-Hua ; et al. | 2016-07-28 |
Semiconductor device having trench adjacent to receiving area and method of forming the same
Grant 9,397,056 - Wang , et al. July 19, 2 | 2016-07-19 |
Semiconductor device and manufacturing method thereof
Grant 9,379,076 - Hsieh , et al. June 28, 2 | 2016-06-28 |
Semiconductor device comprising a chip substrate, a mold, and a buffer layer
Grant 9,343,385 - Wu , et al. May 17, 2 | 2016-05-17 |
Copper post structure for wafer level chip scale package
Grant 9,343,415 - Shih , et al. May 17, 2 | 2016-05-17 |
Automatic pill grasping apparatus and method
Grant 9,333,653 - Huang , et al. May 10, 2 | 2016-05-10 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160126324 - YU; CHEN-HUA ; et al. | 2016-05-05 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160099221 - CHIANG; YUNG-PING ; et al. | 2016-04-07 |
Semiconductor Device And Manufacturing Method Thereof
App 20160099223 - HSIEH; CHEN-CHIH ; et al. | 2016-04-07 |
3D package with through substrate vias
Grant 9,305,877 - Yu , et al. April 5, 2 | 2016-04-05 |
Automatic pill grasping apparatus
Grant 9,284,111 - Huang , et al. March 15, 2 | 2016-03-15 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160035639 - WU; NIEN-FANG ; et al. | 2016-02-04 |
Semiconductor Device And Manufacturing Method Thereof
App 20160020181 - YU; TSUNG-YUAN ; et al. | 2016-01-21 |
Methods and apparatus for heat spreader on silicon
Grant 9,236,322 - Chen , et al. January 12, 2 | 2016-01-12 |
Semiconductor Device And Manufacturing Method Thereof
App 20150380357 - LIU; MING-KAI ; et al. | 2015-12-31 |
Semiconductor Device And Manufacturing Method Thereof
App 20150364376 - YU; TSUNG-YUAN ; et al. | 2015-12-17 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150348927 - KUO; HSUAN-TING ; et al. | 2015-12-03 |
Semiconductor Device Having Trench Adjacent To Receiving Area And Method Of Forming The Same
App 20150348923 - WANG; YEN-PING ; et al. | 2015-12-03 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150255273 - MIAO; CHIA-CHUN ; et al. | 2015-09-10 |
Copper Post Structure For Wafer Level Chip Scale Package
App 20150228597 - SHIH; Chao-Wen ; et al. | 2015-08-13 |
Semiconductor Device And Manufacturing Method Thereof
App 20150137355 - YU; TSUNG-YUAN ; et al. | 2015-05-21 |
Copper post structure for wafer level chip scale package
Grant 9,035,468 - Shih , et al. May 19, 2 | 2015-05-19 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20150130020 - SHIH; CHAO-WEN ; et al. | 2015-05-14 |
Copper Post Structure for Wafer Level Chip Scale Package
App 20150035139 - Shih; Chao-Wen ; et al. | 2015-02-05 |
Automatic Pill Grasping Apparatus And Method
App 20150028050 - HUANG; SZU-HAI ; et al. | 2015-01-29 |
Automatic Pill Grasping Apparatus
App 20150028048 - HUANG; SZU-HAI ; et al. | 2015-01-29 |
Medications Directing System And Method With Cloud Server
App 20150026232 - CHEN; JENG-CHE ; et al. | 2015-01-22 |
3D semiconductor package interposer with die cavity
Grant 8,865,521 - Jeng , et al. October 21, 2 | 2014-10-21 |
Pill Case Assembly And Pill Dispenser With Pill Case Assembly
App 20140305961 - HUANG; SZU-HAI ; et al. | 2014-10-16 |
Reinforcement structure for flip-chip packaging
Grant 8,810,025 - Liu , et al. August 19, 2 | 2014-08-19 |
Automatic Pill Dispenser
App 20140131378 - SHIH; CHAO-WEN ; et al. | 2014-05-15 |
Package-on-package structures with reduced bump bridging
Grant 8,669,651 - Yang , et al. March 11, 2 | 2014-03-11 |
Methods And Apparatus For Heat Spreader On Silicon
App 20130270686 - Chen; Hsien-Wei ; et al. | 2013-10-17 |
3D Semiconductor Package Interposer with Die Cavity
App 20130252378 - Jeng; Shin-Puu ; et al. | 2013-09-26 |
3D semiconductor package interposer with die cavity
Grant 8,519,537 - Jeng , et al. August 27, 2 | 2013-08-27 |
Semiconductor device having pad structure with stress buffer layer
Grant 8,283,781 - Wu , et al. October 9, 2 | 2012-10-09 |
Reinforcement Structure For Flip-chip Packaging
App 20120235303 - Liu; Yu-Wen ; et al. | 2012-09-20 |
Circuit board structure and method for manufacturing the same
Grant 8,158,891 - Shih April 17, 2 | 2012-04-17 |
Semiconductor Device Having Pad Structure With Stress Buffer Layer
App 20120061823 - WU; Wei-Cheng ; et al. | 2012-03-15 |
Package-on-Package Structures with Reduced Bump Bridging
App 20120018877 - Yang; Chung-Ying ; et al. | 2012-01-26 |
Circuit board with identifiable information and method for fabricating the same
Grant 8,070,932 - Hsu , et al. December 6, 2 | 2011-12-06 |
Package substrate having electrically connecting structure
Grant 8,022,530 - Shih September 20, 2 | 2011-09-20 |
3D Semiconductor Package Using An Interposer
App 20110210444 - Jeng; Shin-Puu ; et al. | 2011-09-01 |
Circuit board structure and fabrication method thereof
Grant 7,964,801 - Shih June 21, 2 | 2011-06-21 |
Circuit board structure
Grant 7,948,085 - Shih , et al. May 24, 2 | 2011-05-24 |
Electrically connecting terminal structure of circuit board and manufacturing method thereof
Grant 7,719,853 - Shih May 18, 2 | 2010-05-18 |
Packaging substrate
App 20100096750 - Shih; Chao-Wen ; et al. | 2010-04-22 |
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
Grant 7,659,193 - Hu , et al. February 9, 2 | 2010-02-09 |
Package Substrate Having Double-sided Circuits And Fabrication Method Thereof
App 20090308652 - Shih; Chao-Wen | 2009-12-17 |
Method for fabricating electrical conductive structure of circuit board
Grant 7,553,750 - Shih June 30, 2 | 2009-06-30 |
Methods for repairing circuit board having defective pre-soldering bump
Grant 7,546,682 - Hsu , et al. June 16, 2 | 2009-06-16 |
Package Substrate Having Electrically Connecting Structure
App 20090146317 - Shih; Chao-Wen | 2009-06-11 |
Circuit Board And Fabrication Method Thereof
App 20090090548 - Shih; Chao-Wen ; et al. | 2009-04-09 |
Circuit board structure and method for manufacturing the same
App 20090065246 - Shih; Chao-Wen | 2009-03-12 |
Flip-chip substrate
App 20080230260 - SHIH; Chao-Wen | 2008-09-25 |
Method of fabricating circuit board having different electrical connection structures
Grant 7,419,897 - Shih September 2, 2 | 2008-09-02 |
Circuit Board Structure And Fabrication Method Of The Same
App 20080176035 - Shih; Chao-Wen ; et al. | 2008-07-24 |
Circuit Board Structure And Fabrication Method Thereof
App 20080174009 - Shih; Chao-Wen | 2008-07-24 |
Circuit board with identifiable information and method for fabricating the same
App 20080166497 - Hsu; Shih-Ping ; et al. | 2008-07-10 |
Circuit board with identifiable information and method for fabricating the same
Grant 7,365,272 - Hsu , et al. April 29, 2 | 2008-04-29 |
Repaired pre-soldering structure of circuit board and method thereof
App 20080083819 - Hsu; Shih-Ping ; et al. | 2008-04-10 |
Method for repairing metal finish layer on surface of electrical connection pad of circuit board
App 20080083115 - Hsu; Shih-Ping ; et al. | 2008-04-10 |
Method for fabricating circuit board with conductive structure
Grant 7,350,298 - Hsu , et al. April 1, 2 | 2008-04-01 |
Method for fabricating conductive bump of circuit board
Grant 7,341,934 - Hsu , et al. March 11, 2 | 2008-03-11 |
Carrier board structure with semiconductor chip embedded therein
App 20080054443 - Shih; Chao-Wen | 2008-03-06 |
Electrically Connecting Terminal Structure of Circuit Board and Manufacturing Method Thereof
App 20080020602 - SHIH; Chao-Wen | 2008-01-24 |
Method Of Fabricating Circuit Board Having Different Electrical Connection Structures
App 20070281557 - Shih; Chao-Wen | 2007-12-06 |
Method For Fabricating Electrical Conductive Structure Of Circuit Board
App 20070281389 - Shih; Chao Wen | 2007-12-06 |
Method For Repairing Conductive Structure Of Circuit Board
App 20070281503 - Hsu; Shih-Ping ; et al. | 2007-12-06 |
Method For Repairing Elecrical Circuit Of Circuit Board
App 20070274028 - HSU; Shih-Ping ; et al. | 2007-11-29 |
Method for Fabricating Circuit Board with Conductive Structure
App 20070186412 - Hsu; Shih-Ping ; et al. | 2007-08-16 |
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
App 20070161223 - Hu; Wen-Hung ; et al. | 2007-07-12 |
Method for fabricating connection terminal of circuit board
Grant 7,174,630 - Hsu , et al. February 13, 2 | 2007-02-13 |
Method for fabricating electrical connection structure of circuit board
Grant 7,151,050 - Hsu , et al. December 19, 2 | 2006-12-19 |
Solder ball pad surface finish structure of circuit board and fabrication method thereof
App 20060252249 - Hsu; Shih-Ping ; et al. | 2006-11-09 |
Processing apparatus for electroplating conductive bumps on organic circuit board
App 20060252247 - Hsu; Shih-Ping ; et al. | 2006-11-09 |
Method for fabricating connection terminal of circuit board
App 20060090335 - Hsu; Shih-Ping ; et al. | 2006-05-04 |
Method for fabricating electrical connection structure of circuit board
App 20060079081 - Hsu; Shih-Ping ; et al. | 2006-04-13 |
Method for fabricating conductive bump of circuit board
App 20060051952 - Hsu; Shih-Ping ; et al. | 2006-03-09 |
Circuit board with identifiable information and method for fabricating the same
App 20050236176 - Hsu, Shih-Ping ; et al. | 2005-10-27 |
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