SHIGETA; HIROYUKI
Patent Applications and Registrations
Patent applications and USPTO patent grants for SHIGETA; HIROYUKI.The latest application filed is for "semiconductor package, electronic device, and method of manufacturing semiconductor package".
- SHIGETA; HIROYUKI - KANAGAWA JP
- Shigeta; Hiroyuki - Osaka JP
| Patent | Date |
|---|---|
| Semiconductor Package, Electronic Device, And Method Of Manufacturing Semiconductor Package App 20220262841 - SHIGETA; HIROYUKI ; et al. | 2022-08-18 |
| Semiconductor Device, Imaging Device, And Method Of Manufacturing Semiconductor Device App 20220139979 - WATANABE; TSUYOSHI ; et al. | 2022-05-05 |
| Semiconductor Device, Imaging Apparatus, And Method For Manufacturing Semiconductor Device App 20210233949 - CHINO; DAISUKE ; et al. | 2021-07-29 |
| Semiconductor chip package for improving freedom of arrangement of external terminals Grant 10,714,402 - Shigeta , et al. | 2020-07-14 |
| Semiconductor Chip Package App 20190139843 - SHIGETA; HIROYUKI ; et al. | 2019-05-09 |
| Multiprocessor system for comparing execution order of tasks to a failure pattern Grant 9,170,841 - Fukuzaki , et al. October 27, 2 | 2015-10-27 |
| Multiprocessor System App 20130104137 - FUKUZAKI; Kiyokazu ; et al. | 2013-04-25 |
| Semiconductor device and method of manufacturing the same Grant 6,054,773 - Ohsawa , et al. April 25, 2 | 2000-04-25 |
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