Shigesada; Tetsuyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shigesada; Tetsuyuki.The latest application filed is for "flux and solder paste".
- Shigesada; Tetsuyuki - Hyogo JP
- Shigesada; Tetsuyuki - Kakogawa-shi JP
| Patent | Date |
|---|---|
| Flux And Solder Paste App 20180339371 - INOUE; Kosuke ; et al. | 2018-11-29 |
| Flux and solder paste Grant 10,099,321 - Inoue , et al. October 16, 2 | 2018-10-16 |
| Solder alloy, solder paste, and electronic circuit board Grant 9,445,508 - Nakanishi , et al. September 13, 2 | 2016-09-13 |
| Flux And Solder Paste App 20150343571 - INOUE; Kosuke ; et al. | 2015-12-03 |
| Solder Alloy, Solder Paste, And Electronic Circuit Board App 20150305167 - NAKANISHI; Kensuke ; et al. | 2015-10-22 |
| Flux For Soldering And Solder Paste Composition App 20140053954 - Inoue; Kousuke ; et al. | 2014-02-27 |
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