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name:-0.0059781074523926
SHIGEMATSU; Koichi Patent Filings

SHIGEMATSU; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIGEMATSU; Koichi.The latest application filed is for "manufacturing method of device chip".

Company Profile
5.17.21
  • SHIGEMATSU; Koichi - Tokyo JP
  • Shigematsu; Koichi - Ota-ku JP
  • Shigematsu; Koichi - Hoi-gun JP
  • Shigematsu; Koichi - Kawanishi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Manufacturing Method Of Device Chip
App 20220102214 - SHIGEMATSU; Koichi ;   et al.
2022-03-31
Processing apparatus and processing method
Grant 11,181,883 - Shigematsu November 23, 2
2021-11-23
Processing apparatus for processing wafer
Grant 11,135,700 - Shigematsu October 5, 2
2021-10-05
Device Chip Manufacturing Method
App 20210193521 - SHIGEMATSU; Koichi ;   et al.
2021-06-24
Laser processing method
Grant 10,943,801 - Shigematsu March 9, 2
2021-03-09
Device wafer processing method
Grant 10,679,897 - Shigematsu , et al.
2020-06-09
Method of detecting spot shape of pulsed laser beam
Grant 10,648,855 - Kojo , et al.
2020-05-12
Processing Apparatus For Processing Wafer
App 20190076986 - Shigematsu; Koichi
2019-03-14
Laser Processing Method
App 20180330972 - Shigematsu; Koichi
2018-11-15
Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object
Grant 10,121,672 - Shigematsu November 6, 2
2018-11-06
Device Wafer Processing Method
App 20180144983 - Shigematsu; Koichi ;   et al.
2018-05-24
Method Of Detecting Spot Shape Of Pulsed Laser Beam
App 20180094972 - Kojo; Tasuku ;   et al.
2018-04-05
Cutting Method For Cutting Processing-target Object And Cutting Apparatus That Cuts Processing-target Object
App 20170372908 - Shigematsu; Koichi
2017-12-28
Processing Apparatus And Processing Method
App 20170343979 - Shigematsu; Koichi
2017-11-30
Laser beam processing machine
Grant 7,994,451 - Shigematsu , et al. August 9, 2
2011-08-09
Wafer laser processing method
Grant 7,521,337 - Sekiya , et al. April 21, 2
2009-04-21
Method of laser processing a liquid crystal device wafer
Grant 7,483,115 - Shigematsu , et al. January 27, 2
2009-01-27
Semiconductor wafer treatment method
Grant 7,468,309 - Shigematsu , et al. December 23, 2
2008-12-23
Laser beam machining system
App 20080128396 - Shigematsu; Koichi ;   et al.
2008-06-05
Laser beam processing method and laser beam processing machine
App 20080105662 - Shigematsu; Koichi ;   et al.
2008-05-08
Wafer laser processing method
App 20080007737 - Sekiya; Kazuma ;   et al.
2008-01-10
Laser beam processing method for a semiconductor wafer
Grant 7,265,033 - Shigematsu , et al. September 4, 2
2007-09-04
Method of laser processing a liquid crystal device wafer
App 20070035692 - Shigematsu; Koichi ;   et al.
2007-02-15
Semiconductor wafer treatment method
App 20060223285 - Shigematsu; Koichi ;   et al.
2006-10-05
Laser processing method and laser beam processing machine
App 20060197260 - Yoshikawa; Toshiyuki ;   et al.
2006-09-07
Laser beam processing machine
App 20060119691 - Shigematsu; Koichi ;   et al.
2006-06-08
Processing apparatus provided with backpressure sensor
Grant 7,001,247 - Shigematsu February 21, 2
2006-02-21
Laser beam machine
App 20050061789 - Nagai, Yusuke ;   et al.
2005-03-24
Processing apparatus provided with backpressure sensor
App 20050045009 - Shigematsu, Koichi
2005-03-03
Laser beam processing method and laser beam processing machine
App 20050009307 - Shigematsu, Koichi ;   et al.
2005-01-13
Laser beam processing method and laser beam processing machine
App 20050006358 - Shigematsu, Koichi ;   et al.
2005-01-13
Method of connecting circuit boards
Grant 6,719,187 - Miyake , et al. April 13, 2
2004-04-13
Method of connecting circuit boards
App 20030205610 - Miyake, Toshihiro ;   et al.
2003-11-06
Method of connecting circuit boards
Grant 6,598,780 - Miyake , et al. July 29, 2
2003-07-29
Method of connecting circuit boards
App 20010013535 - Miyake, Toshihiro ;   et al.
2001-08-16
Output control apparatus for a microwave oven
Grant 4,300,032 - Niu , et al. November 10, 1
1981-11-10
Blood pressure and pulse rate measuring apparatus
Grant 4,105,020 - Matsuoka , et al. August 8, 1
1978-08-08
Blood pressure measuring apparatus
Grant 4,026,277 - Toda , et al. May 31, 1
1977-05-31

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