Shiga; Eisuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiga; Eisuke.The latest application filed is for "resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board".

Company Profile

5.19.19

Shiga; Eisuke - Tokyo JP
Shiga; Eisuke - Katsushika-ku JP
SHIGA; Eisuke - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Display screen or portion thereof with graphical user interface Grant D965,008 - Oshima , et al. September 27, 2	2022-09-27
Display screen or portion thereof with graphical user interface Grant D965,009 - Oshima , et al. September 27, 2	2022-09-27
Display screen or portion thereof with graphical user interface Grant D964,389 - Oshima , et al. September 20, 2	2022-09-20
Display screen or portion thereof with graphical user interface Grant D964,388 - Oshima , et al. September 20, 2	2022-09-20
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20220076859 - TOMIZAWA; Katsuya ; et al.	2022-03-10
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board Grant 11,195,638 - Tomizawa , et al. December 7, 2	2021-12-07
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board Grant 10,869,390 - Ohnishi , et al. December 15, 2	2020-12-15
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board Grant 10,815,349 - Tomizawa , et al. October 27, 2	2020-10-27
Resin Composition, Prepreg, Laminate, Metal Foil-clad Laminate, Printed Wiring Board, And Multilayer Printed Wiring Board App 20200325292 - HAMAJIMA; Tomoki ; et al.	2020-10-15
Prepreg, metal foil-clad laminate, and printed wiring board Grant 10,791,626 - Hamajima , et al. September 29, 2	2020-09-29
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them Grant 10,721,817 - Takano , et al.	2020-07-21
Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same Grant 10,717,837 - Tomizawa , et al.	2020-07-21
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them Grant 10,703,874 - Takano , et al.	2020-07-07
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board Grant 10,676,579 - Tomizawa , et al.	2020-06-09
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20200152349 - TOMIZAWA; Katsuya ; et al.	2020-05-14
Resin composition and prepreg, resin sheet, laminate, and printed circuit board Grant 10,563,029 - Takano , et al. Feb	2020-02-18
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board Grant 10,550,228 - Kashima , et al. Fe	2020-02-04
Insulating layer for printed circuit board and printed circuit board Grant 10,292,260 - Tomizawa , et al.	2019-05-14
Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board Grant 10,178,767 - Chiba , et al. J	2019-01-08
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board Grant 10,138,393 - Tomizawa , et al. Nov	2018-11-27
Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board Grant 10,030,141 - Chiba , et al. July 24, 2	2018-07-24
Resin Composition, Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20180199435 - OHNISHI; Nobuyoshi ; et al.	2018-07-12
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20180197655 - TOMIZAWA; Katsuya ; et al.	2018-07-12
Resin Composition And Prepreg, Resin Sheet, Laminate, And Printed Circuit Board App 20180186952 - TAKANO; Yoichi ; et al.	2018-07-05
Resin Composition, Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20180186933 - KASHIMA; Naoki ; et al.	2018-07-05
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20180179355 - TOMIZAWA; Katsuya ; et al.	2018-06-28
Resin Composition, Prepreg Or Resin Sheet Comprising The Resin Composition, And Laminate And Printed Circuit Board Comprising Them App 20180179353 - TAKANO; Yoichi ; et al.	2018-06-28
Resin Composition And Prepreg, Resin Sheet, Laminate, And Printed Circuit Board Comprising Same App 20180179354 - TOMIZAWA; Katsuya ; et al.	2018-06-28
Resin Composition, Prepreg Or Resin Sheet Comprising The Resin Composition, And Laminate And Printed Circuit Board Comprising Them App 20180177047 - TAKANO; Yoichi ; et al.	2018-06-21
Method For Producing Printed Circuit Board, And Resin Composition App 20180163048 - TOMIZAWA; Katsuya ; et al.	2018-06-14
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20180155514 - TOMIZAWA; Katsuya ; et al.	2018-06-07
Resin composition, prepreg, laminate, and printed wiring board Grant 9,902,851 - Takahashi , et al. February 27, 2	2018-02-27
Insulating Layer For Printed Circuit Board, And Printed Circuit Board App 20160309582 - TOMIZAWA; Katsuya ; et al.	2016-10-20
Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20160219700 - HAMAJIMA; Tomoki ; et al.	2016-07-28
Resin Composition, Prepreg, Laminate, Metal Foil-clad Laminate, And Printed-wiring Board App 20150344733 - TOMIZAWA; Katsuya ; et al.	2015-12-03
Resin Composition, Prepreg, Laminate, Metallic Foil Clad Laminate, And Printed Circuit Board App 20150319853 - CHIBA; Tomo ; et al.	2015-11-05
Resin Composition, Pre-preg, Laminate, Metal Foil-clad Laminate, And Printed Wiring Board App 20150307708 - CHIBA; Tomo ; et al.	2015-10-29
Resin Composition, Prepreg, Laminate, And Printed Wiring Board App 20150267047 - Takahashi; Hiroshi ; et al.	2015-09-24

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