loadpatents
name:-0.012433052062988
name:-0.0048210620880127
name:-0.00046491622924805
Shieh; Brian Sy-Yuan Patent Filings

Shieh; Brian Sy-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shieh; Brian Sy-Yuan.The latest application filed is for "method and apparatus for remote plasma source assisted silicon-containing film deposition".

Company Profile
0.5.8
  • Shieh; Brian Sy-Yuan - Palo Alto CA US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Gas distribution blocker apparatus
Grant 9,714,465 - Tsuei , et al. July 25, 2
2017-07-25
Method And Apparatus For Remote Plasma Source Assisted Silicon-containing Film Deposition
App 20130012030 - Lakshmanan; Annamalai ;   et al.
2013-01-10
Apparatus And Method For Preventing Process System Contamination
App 20100151127 - Cho; Tom K. ;   et al.
2010-06-17
Gas Distribution Blocker Apparatus
App 20100136216 - Tsuei; Lun ;   et al.
2010-06-03
Adjustable Gas Distribution Apparatus
App 20100112212 - Zhang; Lin ;   et al.
2010-05-06
Multiple Gas Feed Apparatus And Method
App 20100104754 - TSO; ALAN ;   et al.
2010-04-29
Showerhead And Shadow Frame
App 20100037823 - CHO; TOM K. ;   et al.
2010-02-18
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
Grant 6,949,203 - Hsieh , et al. September 27, 2
2005-09-27
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
Grant 6,793,835 - Luo , et al. September 21, 2
2004-09-21
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
App 20030164354 - Hsieh, Chang-Lin ;   et al.
2003-09-04
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
App 20030057179 - Luo, Lee ;   et al.
2003-03-27
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
Grant 6,500,357 - Luo , et al. December 31, 2
2002-12-31

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