Shie; Tung-Heng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shie; Tung-Heng.The latest application filed is for "spacer layer etch method providing enhanced microelectronic device performance".
- Shie; Tung-Heng - Hsinchu TW
- Shie; Tung-Heng - Hsinchu City TW
- Shie, Tung-Heng - Hsin-Chu TW
| Patent | Date |
|---|---|
| Spacer layer etch method providing enhanced microelectronic device performance Grant 7,678,655 - Su , et al. March 16, 2 | 2010-03-16 |
| Spacer layer etch method providing enhanced microelectronic device performance App 20080026518 - Su; Hung Der ; et al. | 2008-01-31 |
| Method to enhance the adhesion between dry film and seed metal Grant 6,926,818 - Lin , et al. August 9, 2 | 2005-08-09 |
| System-on-chip (SOC) solutions with multiple devices by multiple poly gate trimming process Grant 6,828,198 - Su , et al. December 7, 2 | 2004-12-07 |
| System-on-chip (SOC) solutions with multiple devices by multiple poly gate trimming process App 20040185623 - Su, Hung-Der ; et al. | 2004-09-23 |
| Method of making a bump on a substrate without ribbon residue Grant 6,696,356 - Tseng , et al. February 24, 2 | 2004-02-24 |
| Method of making a bump on a substrate without ribbon residue App 20030124832 - Tseng, Li-Hsin ; et al. | 2003-07-03 |
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