loadpatents
name:-0.018421173095703
name:-0.013229131698608
name:-0.0039501190185547
SHIE; Jin-Shown Patent Filings

SHIE; Jin-Shown

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIE; Jin-Shown.The latest application filed is for "infrared filter and thermal infrared sensing device including the same".

Company Profile
2.10.12
  • SHIE; Jin-Shown - Baoshan Township TW
  • Shie; Jin-Shown - Hsinchu TW
  • Shie; Jin-Shown - Hsinchu County TW
  • Shie; Jin Shown - Hsinchu City TW
  • Shie, Jin-shown - Hsin Chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Infrared Filter And Thermal Infrared Sensing Device Including The Same
App 20220221635 - SHIE; Jin-Shown
2022-07-14
Infrared thermal emitter
Grant 11,004,997 - Shie , et al. May 11, 2
2021-05-11
Infrared Thermal Emitter
App 20200083394 - SHIE; Jin-Shown ;   et al.
2020-03-12
Finger sensing structure for capacitive fingerprint recognition IC
Grant 9,129,143 - Shie , et al. September 8, 2
2015-09-08
Finger Sensing Structure For Capacitive Fingerprint Recognition Ic
App 20140369574 - SHIE; Jin-Shown ;   et al.
2014-12-18
Non-dispersive Infrared Gas Detector, And Method Of Stabilizing Infrared Emission Of An Incandescent Lamp
App 20140209800 - SHIE; Jin-Shown ;   et al.
2014-07-31
Chip-scale infrared emitter package
Grant 8,575,578 - Shie , et al. November 5, 2
2013-11-05
Stack-integrated package of optical transceiver for single core full duplex fiber communications
Grant 7,333,684 - Shie , et al. February 19, 2
2008-02-19
Structure and manufacturing method of high precision chip capacitor fabricated on silicon substrate
App 20070267719 - Shie; Jin Shown
2007-11-22
Wire-bonding free packaging structure of light emitted diode
App 20070228386 - Shie; Jin-Shown ;   et al.
2007-10-04
Fabrication method of spiral inductor on porous glass substrate
Grant 7,247,542 - Shie July 24, 2
2007-07-24
Monolithic fabrication method and structure of array nozzles on thermal inkjet print head
App 20070153062 - Shie; Jin Shown ;   et al.
2007-07-05
Fabrication method of spiral inductor on porous glass substrate
App 20070034910 - Shie; Jin Shown
2007-02-15
Packaging structure of LED-multiplexer/driver hybridzation for LED printer head
App 20060125910 - Shie; Jin Shown ;   et al.
2006-06-15
Stack-integrated package of optical transceiver for single core full duplex fiber communications
App 20050213983 - Shie, Jin Shown ;   et al.
2005-09-29
Silicon Pressure Micro-sensing Device And The Fabrication Process
App 20030068838 - Shie, Jin-shown ;   et al.
2003-04-10
Heat dissipation structure for solid-state light emitting device package
Grant 6,480,389 - Shie , et al. November 12, 2
2002-11-12
LED array with optical isolation structure and method of manufacturing the same
App 20020153529 - Shie, Jin-Shown
2002-10-24
Solid-state switch driven by thermovoltaic generator
Grant 6,013,935 - Shie January 11, 2
2000-01-11
Tympanic thermometer arrangement
Grant 5,820,264 - Tsao , et al. October 13, 1
1998-10-13
Substrate structure of monolithic gas sensor
Grant 5,659,127 - Shie , et al. August 19, 1
1997-08-19
Structure of micro-pirani sensor
Grant 5,347,869 - Shie , et al. September 20, 1
1994-09-20

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